Inventor · disambiguated record
Rung-De Wang
Also filed as: WANG RUNG-DE
9 granted patents·1 pending application·47 citations·filing 2010–2025
86Inventor score
Top patents by PatentIndex Score
10 records- 0194US10276514B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·14 cites·18 claims
- 0292US8901736B2Strength of micro-bump jointsShen wen-wei·Filed 2010·Granted Dec 2, 2014·15 cites·20 claims
- 0390US11348879B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 0490US9768138B2Improving the strength of micro-bump jointsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 19, 2017·6 cites·19 claims
- 0588US9837366B1Semicondcutor structure and semiconductor manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·7 cites·20 claims
- 0685US10818612B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·3 cites·20 claims
- 0776US11855007B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 0863US12230593B2Wafer level package with polymer layer delamination prevention design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 0962US2025157955A1Wafer level package with polymer layer delamination prevention design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1058US9219046B2Strength of micro-bump jointsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 22, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →