Inventor · disambiguated record
Russell Westerman
Also filed as: WESTERMAN RUSSELL
48 granted patents·10 pending applications·207 citations·filing 2001–2025
98Inventor score
Top patents by PatentIndex Score
58 records- 0195US8802545B2Method and apparatus for plasma dicing a semi-conductor waferJOHNSON CHRIS·Filed 2012·Granted Aug 12, 2014·15 cites·5 claims
- 0295US8785332B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Jul 22, 2014·15 cites·2 claims
- 0393US8778806B2Method and apparatus for plasma dicing a semi-conductor waferJOHNSON CHRIS·Filed 2012·Granted Jul 15, 2014·10 cites·12 claims
- 0491US9711406B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2016·Granted Jul 18, 2017·6 cites·7 claims
- 0591US8691702B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Apr 8, 2014·13 cites·6 claims
- 0687US11587834B1Protective coating for plasma dicingPLASMA THERM LLC·Filed 2021·Granted Feb 21, 2023·1 cites·16 claims
- 0784US10818552B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2019·Granted Oct 27, 2020·3 cites·26 claims
- 0884US6924235B2Sidewall smoothing in high aspect ratio/deep etching using a discrete gas switching methodUNAXIS USA INC·Filed 2003·Granted Aug 2, 2005·33 cites·17 claims
- 0983US9070760B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Jun 30, 2015·3 cites·21 claims
- 1083US6982175B2End point detection in time division multiplexed etch processesUNAXIS USA INC·Filed 2004·Granted Jan 3, 2006·18 cites·20 claims
- 1182US11747494B2Ion filter using aperture plate with plurality of zonesPLASMA THERM LLC·Filed 2020·Granted Sep 5, 2023·1 cites·17 claims
- 1282US7101805B2Envelope follower end point detection in time division multiplexed processesUNAXIS USA INC·Filed 2004·Granted Sep 5, 2006·26 cites·47 claims
- 1380US8796154B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Aug 5, 2014·2 cites·11 claims
- 1477US9911654B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2016·Granted Mar 6, 2018·1 cites·8 claims
- 1577US6544696B2Embedded attenuated phase shift mask and method of making embedded attenuated phase shift maskUNAXIS USA INC·Filed 2001·Granted Apr 8, 2003·15 cites·27 claims
- 1676US9564366B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2015·Granted Feb 7, 2017·1 cites·3 claims
- 1775US11908741B1Protective coating for plasma dicingPLASMA THERM LLC·Filed 2023·Granted Feb 20, 2024·0 cites·16 claims
- 1875US9082839B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2014·Granted Jul 14, 2015·3 cites·14 claims
- 1975US7713432B2Method and apparatus to improve plasma etch uniformityJOHNSON DAVID·Filed 2005·Granted May 11, 2010·3 cites·12 claims
- 2073US8980764B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Mar 17, 2015·1 cites·5 claims
- 2172US9105705B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Aug 11, 2015·1 cites·26 claims
- 2272US7381650B2Method and apparatus for process control in time division multiplexed (TDM) etch processesUNAXIS USA INC·Filed 2005·Granted Jun 3, 2008·5 cites·35 claims
- 2371US10269641B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2017·Granted Apr 23, 2019·1 cites·26 claims
- 2470US7959819B2Method and apparatus for reducing aspect ratio dependent etching in time division multiplexed etch processesLAI SHOULIANG·Filed 2005·Granted Jun 14, 2011·4 cites·4 claims
- 2569US9343365B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted May 17, 2016·2 cites·9 claims
- 2668US11488865B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2019·Granted Nov 1, 2022·0 cites·8 claims
- 2767US10707060B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2018·Granted Jul 7, 2020·0 cites·12 claims
- 2867US6905626B2Notch-free etching of high aspect SOI structures using alternating deposition and etching and pulsed plasmaUNAXIS USA INC·Filed 2003·Granted Jun 14, 2005·11 cites·16 claims
- 2966US11651999B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2020·Granted May 16, 2023·0 cites·23 claims
- 3066US7867403B2Temperature control method for photolithographic substratePLUMHOFF JASON·Filed 2007·Granted Jan 11, 2011·2 cites·20 claims
- 3165US10741447B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2018·Granted Aug 11, 2020·0 cites·14 claims
- 3262US12489018B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2022·Granted Dec 2, 2025·0 cites·8 claims
- 3361US10297427B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2015·Granted May 21, 2019·0 cites·6 claims
- 3461US9202721B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2014·Granted Dec 1, 2015·0 cites·7 claims
- 3561US2025283209A1Ion beam depositionPLASMA THERM NES LLC·Filed 2025·Application pending·0 cites
- 3660US9202720B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Dec 1, 2015·0 cites·5 claims
- 3759US9496177B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2015·Granted Nov 15, 2016·0 cites·6 claims
- 3858US10573557B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2015·Granted Feb 25, 2020·0 cites·7 claims
- 3958US2023343647A1Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2023·Application pending·0 cites
- 4055US7115520B2Method and apparatus for process control in time division multiplexed (TDM) etch processUNAXIS USA INC·Filed 2004·Granted Oct 3, 2006·5 cites·31 claims
- 4155US6846747B2Method for etching viasUNAXIS USA INC·Filed 2003·Granted Jan 25, 2005·4 cites·23 claims
- 4254US12368117B2Electrostatic discharge prevention in ion beam systemPLASMA THERM NES LLC·Filed 2023·Granted Jul 22, 2025·0 cites·6 claims
- 4353US8946058B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Feb 3, 2015·0 cites·42 claims
- 4453US2023253252A1Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2023·Application pending·0 cites
- 4551US2018143332A1Ion FilterPLASMA THERM LLC·Filed 2017·Application pending·0 cites
- 4651US2023343557A1Virtual shutter in ion beam systemPLASMA THERM NES LLC·Filed 2022·Application pending·0 cites
- 4749US9368404B2Method for dicing a substrate with back metalPLASMA THERM LLC·Filed 2013·Granted Jun 14, 2016·0 cites·15 claims
- 4849US7008877B2Etching of chromium layers on photomasks utilizing high density plasma and low frequency RF biasUNAXIS USA INC·Filed 2004·Granted Mar 7, 2006·2 cites·36 claims
- 4949US2007175856A1Notch-Free Etching of High Aspect SOI Structures Using A Time Division Multiplex Process and RF Bias ModulationJOHNSON DAVID·Filed 2007·Application pending·0 cites
- 5048US10497621B2Method for dicing a substrate with back metalPLASMA THERM LLC·Filed 2016·Granted Dec 3, 2019·0 cites·13 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →