Inventor · disambiguated record
Ryo Fukuchi
Also filed as: FUKUCHI RYO
13 granted patents·8 pending applications·22 citations·filing 2009–2018
86Inventor score
Top patents by PatentIndex Score
21 records- 0190US10925171B2Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2018·Granted Feb 16, 2021·3 cites·22 claims
- 0290US9060431B2Liquid crystal polymer copper-clad laminate and copper foil used for said laminateARAI HIDETA·Filed 2012·Granted Jun 16, 2015·7 cites·34 claims
- 0389US9724896B2Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2015·Granted Aug 8, 2017·8 cites·21 claims
- 0468US10464291B2Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2017·Granted Nov 5, 2019·1 cites·24 claims
- 0566US8357307B2Method of forming electronic circuitJX NIPPON MINING & METALS CORP·Filed 2009·Granted Jan 22, 2013·2 cites·13 claims
- 0663US10383222B2Surface-treated copper foilJX NIPPON MINING & METALS CORP·Filed 2017·Granted Aug 13, 2019·0 cites·38 claims
- 0759US10070521B2Surface-treated copper foilJX NIPPON MINING & METALS CORP·Filed 2013·Granted Sep 4, 2018·1 cites·16 claims
- 0858US8668994B2Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using sameYAMANISHI KEISUKE·Filed 2009·Granted Mar 11, 2014·0 cites·19 claims
- 0953US10925170B2Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2018·Granted Feb 16, 2021·0 cites·25 claims
- 1052US10820414B2Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2017·Granted Oct 27, 2020·0 cites·24 claims
- 1151US10791631B2Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2017·Granted Sep 29, 2020·0 cites·25 claims
- 1250US2011259848A1Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using SameJX NIPPON MINING & METALS CORP·Filed 2009·Application pending·0 cites
- 1350US2018288867A1Surface treated copper foil, laminate using the same, copper foil with carrier, printed wiring board, electronic device, and method for manufacturing printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2018·Application pending·0 cites
- 1448US2013270218A1Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using SameJX NIPPON MINING & METALS CORP·Filed 2013·Application pending·0 cites
- 1547US2016212836A1Surface-Treated Metal Material, Metal Foil With Carrier, Connector, Terminal, Laminate, Shielding Tape, Shielding Material, Printed Wiring Board, Processed Metal Member, Electronic Device, And Method For Manufacturing Printed Wiring BoardJX NIPPON MINING & METALS CORP·Filed 2014·Application pending·0 cites
- 1644US10448507B2Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antennaJX NIPPON MINING & METALS CORP·Filed 2017·Granted Oct 15, 2019·0 cites·23 claims
- 1743US2011300401A1Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using sameYAMANISHI KEISUKE·Filed 2010·Application pending·0 cites
- 1840US8580390B2Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using sameYAMANISHI KEISUKE·Filed 2009·Granted Nov 12, 2013·0 cites·19 claims
- 1939US2012318568A1Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuitYAMANISHI KEISUKE·Filed 2011·Application pending·0 cites
- 2038US2017303405A1Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic DeviceJX NIPPON MINING & METALS CORP·Filed 2017·Application pending·0 cites
- 2137US2017208680A1Copper Foil, Copper-Clad Laminate Board, Method For Producing Printed Wiring Board, Method For Producing Electronic Apparauts, Method For Producing Transmission Channel, And Method For Producing AntennaJX NIPPON MINING & METALS CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →