Inventor · disambiguated record
Ryo Haruta
Also filed as: HARUTA RYO
23 granted patents·2 pending applications·645 citations·filing 1983–2005
97Inventor score
Top patents by PatentIndex Score
25 records- 0194US5336638AProcess for manufacturing semiconductor devicesHITACHI LTD·Filed 1992·Granted Aug 9, 1994·129 cites·29 claims
- 0292US6232650B1Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuitingHITACHI LTD·Filed 1998·Granted May 15, 2001·94 cites·9 claims
- 0390US6476467B2Semiconductor device and process for producing the sameHITACHI LTD·Filed 2001·Granted Nov 5, 2002·56 cites·9 claims
- 0488US6897570B2Semiconductor device and method of manufacturing sameRENESAS TECH CORP·Filed 2003·Granted May 24, 2005·54 cites·19 claims
- 0586US6340793B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Jan 22, 2002·37 cites·14 claims
- 0684US6404049B1Semiconductor device, manufacturing method thereof and mounting boardHITACHI LTD·Filed 1996·Granted Jun 11, 2002·59 cites·30 claims
- 0779US6512176B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted Jan 28, 2003·23 cites·18 claims
- 0879US6278176B1Semiconductor device and process for producing the sameHITACHI LTD·Filed 2000·Granted Aug 21, 2001·24 cites·11 claims
- 0979US5140272AMethod of semiconductor surface measurment and an apparatus for realizing the sameHITACHI LTD·Filed 1988·Granted Aug 18, 1992·34 cites·8 claims
- 1075US6764878B2Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrateRENESAS TECH CORP·Filed 2002·Granted Jul 20, 2004·13 cites·8 claims
- 1170US6621160B2Semiconductor device and mounting boardHITACHI LTD·Filed 2002·Granted Sep 16, 2003·13 cites·1 claims
- 1270US6590275B2Ball grid array type semiconductor package having a flexible substrateHITACHI LTD·Filed 2002·Granted Jul 8, 2003·10 cites·15 claims
- 1369US6563212B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted May 13, 2003·12 cites·2 claims
- 1468US6437428B1Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Aug 20, 2002·9 cites·2 claims
- 1562US6060770ASemiconductor device and process for producing the sameHITACHI LTD·Filed 1998·Granted May 9, 2000·23 cites·5 claims
- 1660US6887739B2Method of manufacturing semiconductor package including forming a resin sealing memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2003·Granted May 3, 2005·5 cites·9 claims
- 1757US6476466B2Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2002·Granted Nov 5, 2002·4 cites·1 claims
- 1857US6448111B1Method of manufacturing a semiconductor deviceHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Sep 10, 2002·4 cites·7 claims
- 1953US6465876B1Semiconductor device and lead frame thereforHITACHI LTD·Filed 1997·Granted Oct 15, 2002·16 cites·5 claims
- 2050US6759279B2Method of manufacturing semiconductor device having resin sealing bodyRENESAS TECH CORP·Filed 2002·Granted Jul 6, 2004·2 cites·6 claims
- 2147US6844219B2Semiconductor device and lead frame thereforRENESAS TECH CORP·Filed 2002·Granted Jan 18, 2005·2 cites·7 claims
- 2244US4570175AThree-dimensional semiconductor device with thin film monocrystalline member contacting substrate at a plurality of locationsHITACHI LTD·Filed 1983·Granted Feb 11, 1986·11 cites·3 claims
- 2339US2008122050A1Semiconductor Device And Production Method For Semiconductor DeviceIKEDA OSAMU·Filed 2005·Application pending·0 cites
- 2437US6120301ASemiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1996·Granted Sep 19, 2000·11 cites·6 claims
- 2535US2001015489A1Semiconductor device and its manufacturing methodFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →