Assignee
HITACHI HOKKAI SEMICONDUCTOR
JP·17 granted patents·1 pending application·105 citations·filing 2000–2005
Top patents by PatentIndex Score
18 records- 0171US7194571B2Microcomputer, programming method and erasing methodHITACHI HOKKAI SEMICONDUCTOR·Filed 2005·Granted Mar 20, 2007·4 cites·9 claims
- 0268US6437428B1Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Aug 20, 2002·9 cites·2 claims
- 0366US6897093B2Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) packageHITACHI HOKKAI SEMICONDUCTOR·Filed 2003·Granted May 24, 2005·11 cites·9 claims
- 0466US6820179B2Semiconductor device and data processing systemHITACHI HOKKAI SEMICONDUCTOR·Filed 2001·Granted Nov 16, 2004·16 cites·14 claims
- 0563US7015119B2Fabrication method of semiconductor integrated circuit deviceHITACHI HOKKAI SEMICONDUCTOR·Filed 2004·Granted Mar 21, 2006·5 cites·28 claims
- 0661US7199469B2Semiconductor device having stacked semiconductor chips sealed with a resin seal memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2001·Granted Apr 3, 2007·12 cites·4 claims
- 0760US6887739B2Method of manufacturing semiconductor package including forming a resin sealing memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2003·Granted May 3, 2005·5 cites·9 claims
- 0858US6951774B2Semiconductor device and method of manufacturing the sameHITACHI HOKKAI SEMICONDUCTOR·Filed 2002·Granted Oct 4, 2005·10 cites·3 claims
- 0957US6476466B2Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2002·Granted Nov 5, 2002·4 cites·1 claims
- 1057US6448111B1Method of manufacturing a semiconductor deviceHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Sep 10, 2002·4 cites·7 claims
- 1154US6909179B2Lead frame and semiconductor device using the lead frame and method of manufacturing the sameHITACHI HOKKAI SEMICONDUCTOR·Filed 2001·Granted Jun 21, 2005·8 cites·18 claims
- 1253US7277979B2Microcomputer with mode-controlled memoryHITACHI HOKKAI SEMICONDUCTOR·Filed 2004·Granted Oct 2, 2007·2 cites·8 claims
- 1353US6974710B2Fabrication method of semiconductor integrated circuit device and testing methodHITACHI HOKKAI SEMICONDUCTOR·Filed 2003·Granted Dec 13, 2005·5 cites·10 claims
- 1452US7253011B2Fabrication method of semiconductor integrated circuit deviceHITACHI HOKKAI SEMICONDUCTOR·Filed 2005·Granted Aug 7, 2007·0 cites·38 claims
- 1551US6947335B2Semiconductor device with an input/output interface circuit for a busHITACHI HOKKAI SEMICONDUCTOR·Filed 2002·Granted Sep 20, 2005·10 cites·18 claims
- 1648US2005281113A1Data processing system and data processing methodHITACHI HOKKAI SEMICONDUCTOR·Filed 2005·Application pending·0 cites
- 1743US7015070B2Electronic device and a method of manufacturing the sameHITACHI HOKKAI SEMICONDUCTOR·Filed 2004·Granted Mar 21, 2006·0 cites·4 claims
- 1840US7093042B2Microcomputer and data processing deviceHITACHI HOKKAI SEMICONDUCTOR·Filed 2002·Granted Aug 15, 2006·0 cites·39 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →