Inventor · disambiguated record
Ryu Kamibaba
Also filed as: KAMIBABA RYU
16 granted patents·1 pending application·4 citations·filing 2014–2022
85Inventor score
Files withMITSUBISHI ELECTRIC CORP17
Top patents by PatentIndex Score
17 records- 0176US11094691B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Aug 17, 2021·1 cites·12 claims
- 0272US11901444B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Feb 13, 2024·0 cites·2 claims
- 0369US10347715B2Semiconductor device having improved safe operating areas and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 9, 2019·1 cites·9 claims
- 0464US10205013B2Semiconductor switching element and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Feb 12, 2019·1 cites·4 claims
- 0562US10176994B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jan 8, 2019·1 cites·11 claims
- 0661US10957691B2Semiconductor device, semiconductor device manufacturing method, and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Mar 23, 2021·0 cites·3 claims
- 0760US11349020B2Semiconductor device and semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2020·Granted May 31, 2022·0 cites·6 claims
- 0858US10600779B2Semiconductor device, semiconductor device manufacturing method, and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Mar 24, 2020·0 cites·5 claims
- 0956US10734506B2Semiconductor device and semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Aug 4, 2020·0 cites·5 claims
- 1055US11398563B2Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 26, 2022·0 cites·8 claims
- 1148US10833574B2Switching element control deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Nov 10, 2020·0 cites·5 claims
- 1247US11462615B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Oct 4, 2022·0 cites·11 claims
- 1345US11322604B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2020·Granted May 3, 2022·0 cites·9 claims
- 1444US11056484B2Semiconductor device with multiple trench structuresMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jul 6, 2021·0 cites·9 claims
- 1537US9871109B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jan 16, 2018·0 cites·6 claims
- 1636US2017294527A1Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2016·Application pending·0 cites
- 1733US12021118B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 25, 2024·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →