Inventor · disambiguated record
Ryuichi Kimura
Also filed as: KIMURA RYUICHI
15 granted patents·19 pending applications·27 citations·filing 1976–2024
88Inventor score
Top patents by PatentIndex Score
34 records- 0178US8563667B2Composition for thermosetting silicone resinKATAYAMA HIROYUKI·Filed 2010·Granted Oct 22, 2013·2 cites·2 claims
- 0277US9768050B2Film for semiconductor back surface and its useNITTO DENKO CORP·Filed 2016·Granted Sep 19, 2017·2 cites·4 claims
- 0371US9082940B2Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Jul 14, 2015·3 cites·12 claims
- 0469US9853892B2Control method, information processing device, and communication systemFUJITSU LTD·Filed 2015·Granted Dec 26, 2017·2 cites·12 claims
- 0566US8318854B2Composition for thermosetting silicone resinKATAYAMA HIROYUKI·Filed 2011·Granted Nov 27, 2012·2 cites·10 claims
- 0659US9153755B2Silicone resin sheet, cured sheet, and light emitting diode device and producing method thereofKIMURA RYUICHI·Filed 2012·Granted Oct 6, 2015·1 cites·6 claims
- 0759US4144153ARadiation process for producing 1,2-polybutadiene foamed productsTAKIRON CO·Filed 1976·Granted Mar 13, 1979·13 cites·9 claims
- 0859US2025370165A1Method of manufacturing optical componentsKOIDE JAPAN LTD·Filed 2023·Application pending·0 cites
- 0956US7710046B2Balance coil and inverter for driving backlightSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 4, 2010·2 cites·15 claims
- 1054US2025201609A1Substrate processing systemSCREEN HOLDINGS CO LTD·Filed 2024·Application pending·0 cites
- 1151US2014367729A1Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1250US8907502B2Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Dec 9, 2014·0 cites·7 claims
- 1348US2014178678A1Encapsulating sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1447US8779043B2Silicone resin composition, silicone resin sheet, optical semiconductor element device, and producing method of silicone resin sheetMATSUDA HIROKAZU·Filed 2012·Granted Jul 15, 2014·0 cites·5 claims
- 1547US2017140974A1Laminated body and composite body; assembly retrieval method; and semiconductor device manufacturing methodNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 1644US2012256220A1Encapsulating sheet, light emitting diode device, and a method for producing the sameKATAYAMA HIROYUKI·Filed 2012·Application pending·0 cites
- 1743US11018996B2Packet transfer device and packet transfer methodFUJITSU LTD·Filed 2019·Granted May 25, 2021·0 cites·10 claims
- 1841US12479011B2Substrate processing system and group management deviceSCREEN HOLDINGS CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 1941US8822351B2Composition for thermosetting silcone resinKIMURA RYUICHI·Filed 2011·Granted Sep 2, 2014·0 cites·7 claims
- 2041US2013256717A1Semiconductor board, semiconductor device, and producing method of semiconductor deviceNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2141US2014001948A1Reflecting layer-phosphor layer-covered led, producing method thereof, led device, and producing method thereofNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2241US2014001949A1Phosphor layer-covered led, producing method thereof, and led deviceNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2341US2014009060A1Phosphor layer-covered led, producing method thereof, and led deviceNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2439US2010209670A1Sheet for photosemiconductor encapsulationNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 2537US2017140948A1Semiconductor package manufacturing methodNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 2637US2017330785A1Sheet, tape, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 2736US8883950B2Silicone resin composition, encapsulating material, and light emitting diode deviceKIMURA RYUICHI·Filed 2012·Granted Nov 11, 2014·0 cites·5 claims
- 2836US2017140973A1Laminate body and composite body; semiconductor device manufacturing methodNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 2935US2016322252A1Rear surface-protective film for protecting rear surface of semiconductor element, integrated film, film, method for producing semiconductor device, and method for producing chipNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 3035US2016322251A1Film for semiconductor device, method for manufacturing semiconductor device, and semiconductor deviceNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 3135US2016322308A1Rear surface-protective film, film, method for producing semiconductor device, and method for producing chipNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 3235US2016322272A1Integrated film, film, method for producing semiconductor device, and method for producing chipNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 3335US2017140972A1Laminated body and semiconductor device manufacturing methodNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 3430US10298440B2Transmission apparatus, alarm transfer method and alarm transfer systemFUJITSU LTD·Filed 2017·Granted May 21, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →