Inventor · disambiguated record
Ryuichi Kondou
Also filed as: KONDOU RYUICHI
7 granted patents·1 pending application·18 citations·filing 2008–2018
80Inventor score
Top patents by PatentIndex Score
8 records- 0191US9892843B2Laminated inductorTAIYO YUDEN KK·Filed 2016·Granted Feb 13, 2018·4 cites·6 claims
- 0280US9601350B2Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assemblySUGA TADATOMO·Filed 2012·Granted Mar 21, 2017·6 cites·12 claims
- 0379US10096418B2Laminated inductorTAIYO YUDEN KK·Filed 2017·Granted Oct 9, 2018·1 cites·6 claims
- 0467US10217557B2Laminated inductorTAIYO YUDEN KK·Filed 2018·Granted Feb 26, 2019·0 cites·6 claims
- 0566US7847469B2Micro-cantileverTAIYO YUDEN KK·Filed 2008·Granted Dec 7, 2010·4 cites·7 claims
- 0665US10166749B2Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assemblySUGA TADATOMO·Filed 2012·Granted Jan 1, 2019·2 cites·13 claims
- 0758US2018061551A1Passive electronic componentTAIYO YUDEN KK·Filed 2017·Application pending·0 cites
- 0851US8853544B2Method of transferring thin film components and circuit board having the sameKONDOU RYUICHI·Filed 2012·Granted Oct 7, 2014·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →