Inventor · disambiguated record
Ryan Lei
Also filed as: LEI RYAN · LEI RYAN Z
6 granted patents·6 pending applications·289 citations·filing 2003–2006
85Inventor score
Top patents by PatentIndex Score
12 records- 0197US6908027B2Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening processINTEL CORP·Filed 2003·Granted Jun 21, 2005·224 cites·8 claims
- 0285US7161224B2Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening processINTEL CORP·Filed 2005·Granted Jan 9, 2007·12 cites·3 claims
- 0379US6833195B1Low temperature germanium transferINTEL CORP·Filed 2003·Granted Dec 21, 2004·30 cites·26 claims
- 0464US7148122B2Bonding of substratesINTEL CORP·Filed 2004·Granted Dec 12, 2006·9 cites·9 claims
- 0561US7279369B2Germanium on insulator fabrication via epitaxial germanium bondingINTEL CORP·Filed 2003·Granted Oct 9, 2007·10 cites·37 claims
- 0647US7211890B2Integrating thermoelectric elements into wafer for heat extractionINTEL CORP·Filed 2003·Granted May 1, 2007·4 cites·18 claims
- 0746US2006046488A1Germanium-on-insulator fabrication utilizing wafer bondingLEI RYAN·Filed 2005·Application pending·0 cites
- 0846US2006049399A1Germanium-on-insulator fabrication utilizing wafer bondingLEI RYAN·Filed 2005·Application pending·0 cites
- 0942US2006286771A1Layer transfer techniqueSHAHEEN MOHAMAD·Filed 2006·Application pending·0 cites
- 1039US2005067377A1Germanium-on-insulator fabrication utilizing wafer bondingFiled 2003·Application pending·0 cites
- 1139US2005211982A1Strained silicon with reduced roughnessLEI RYAN·Filed 2004·Application pending·0 cites
- 1238US2004262686A1Layer transfer techniqueFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →