Inventor · disambiguated record
Ryugo Oba
Also filed as: OBA RYUGO
13 granted patents·9 pending applications·212 citations·filing 2004–2025
91Inventor score
Top patents by PatentIndex Score
22 records- 0196US7179723B2Wafer processing methodDISCO CORP·Filed 2004·Granted Feb 20, 2007·138 cites·7 claims
- 0290US7601616B2Wafer laser processing methodDISCO CORP·Filed 2007·Granted Oct 13, 2009·15 cites·2 claims
- 0389US9724783B2Laser processing apparatusDISCO CORP·Filed 2015·Granted Aug 8, 2017·10 cites·3 claims
- 0486US7897488B2Dividing method for wafer having film on the front side thereofDISCO CORP·Filed 2009·Granted Mar 1, 2011·11 cites·7 claims
- 0584US7655541B2Wafer processing method and laser processing apparatusDISCO CORP·Filed 2008·Granted Feb 2, 2010·10 cites·6 claims
- 0680US8049133B2Laser beam machining apparatusDISCO CORP·Filed 2008·Granted Nov 1, 2011·6 cites·8 claims
- 0778US10109527B2Optical device wafer processing methodDISCO CORP·Filed 2016·Granted Oct 23, 2018·3 cites·6 claims
- 0877US7772092B2Wafer processing methodDISCO CORP·Filed 2008·Granted Aug 10, 2010·6 cites·2 claims
- 0973US7482554B2Laser beam processing machineDISCO CORP·Filed 2006·Granted Jan 27, 2009·4 cites·4 claims
- 1072US8610030B2Laser beam processing machineOBA RYUGO·Filed 2007·Granted Dec 17, 2013·5 cites·2 claims
- 1170US7396780B2Method for laser processing of waferDISCO CORP·Filed 2005·Granted Jul 8, 2008·4 cites·1 claims
- 1268US2025326066A1Laser processing apparatusDISCO CORP·Filed 2025·Application pending·0 cites
- 1352US2010084386A1Laser processing machineDISCO CORP·Filed 2009·Application pending·0 cites
- 1449US7968821B2Laser processing beam machineDISCO CORP·Filed 2007·Granted Jun 28, 2011·0 cites·1 claims
- 1549US2008003708A1Method of processing sapphire substrateHOSHINO HITOSHI·Filed 2007·Application pending·0 cites
- 1647US2006255022A1Wafer laser processing method and laser beam processing machineHOSHINO HITOSHI·Filed 2006·Application pending·0 cites
- 1745US2008047408A1Wafer dividing methodDISCO CORP·Filed 2007·Application pending·0 cites
- 1844US2005155954A1Semiconductor wafer processing methodDISCO CORP·Filed 2005·Application pending·0 cites
- 1941US10811458B2Method of processing waferDISCO CORP·Filed 2018·Granted Oct 20, 2020·0 cites·17 claims
- 2041US2011261457A1Optical device configured by bonding first and second transparent members having birefringent propertyDISCO CORP·Filed 2011·Application pending·0 cites
- 2141US2006009008A1Method for the laser processing of a waferDISCO CORP·Filed 2005·Application pending·0 cites
- 2241US2006035411A1Laser processing methodDISCO CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →