Inventor · disambiguated record
Ryosuke Odaka
Also filed as: ODAKA RYOSUKE
4 granted patents·4 pending applications·1 citations·filing 2011–2025
57Inventor score
Top patents by PatentIndex Score
8 records- 0174US9752058B2Electrically conductive adhesive agent, and method for connecting electronic componentDEXERIALS CORP·Filed 2012·Granted Sep 5, 2017·1 cites·6 claims
- 0272US2025250466A1Method for manufacturing smart card, smart card, and conductive particle-containing hot-melt adhesive sheetDEXERIALS CORP·Filed 2025·Application pending·0 cites
- 0365US12312514B2Method for manufacturing smart cardDEXERIALS CORP·Filed 2021·Granted May 27, 2025·0 cites·11 claims
- 0461US12418130B2Connection body and method for manufacturing connection bodyDEXERIALS CORP·Filed 2021·Granted Sep 16, 2025·0 cites·12 claims
- 0554US2019085211A1Adhesive agent, and method for connecting electronic componentDEXERIALS CORP·Filed 2018·Application pending·0 cites
- 0652US2014352888A1Adhesive agent, and method for connecting electronic componentDEXERIALS CORP·Filed 2012·Application pending·0 cites
- 0750US9426896B2Insulating resin film, bonded structure using insulating resin film, and production method of bonded structureDEXERIALS CORP·Filed 2014·Granted Aug 23, 2016·0 cites·5 claims
- 0845US2012125671A1Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded StructureSATO DAISUKE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →