Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure

Abstract

To provide an insulating resin film, which contains: a first adhesive layer, and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film.

1 . An insulating resin film, comprising:
 a first adhesive layer; and   a second adhesive layer,   wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part,   wherein the first adhesive layer and the second adhesive layer each contain inorganic filler,   wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and   wherein the first adhesive layer has a thickness that is 50% to 90% of a total thickness of the insulating resin film.   
     
     
         2 . The insulating resin film according to  claim 1 , further comprising an intermediate layer provided between the first adhesive layer and the second adhesive layer. 
     
     
         3 . The insulating resin film according to  claim 1 , wherein the first adhesive layer has a glass transition temperature that is higher than a glass transition temperature of the second adhesive layer. 
     
     
         4 . The insulating resin film according to  claim 1 , wherein a difference between the DSC exothermic peak temperature of the first adhesive layer and the DSC exothermic peak temperature of the second. adhesive layer is 7° C. to 10° C. 
     
     
         5 . The insulating resin film according to  claim 1 , wherein a difference in linear expansion coefficient α 1  between the first adhesive layer and the second adhesive layer is smaller than 10 in an absolute value, and a difference in linear expansion coefficient α 2  between the first adhesive layer and the second adhesive layer is smaller than 30 in an absolute value. 
     
     
         6 . A bonded structure, comprising:
 a substrate containing an electrode;   an electronic part containing stud bumps; and   an insulating resin film,   wherein the substrate and the electronic part are bonded together with the insulating resin film, and the electrode of the substrate and the stud bumps of the electronic part are electrically connected, and wherein the insulating resin film contains:   a first adhesive layer; and   a second adhesive layer,   wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part,   wherein the first adhesive layer and the second adhesive layer each contain inorganic filler,   wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and   wherein the first adhesive layer has a thickness that is 50% to 90% of a total thickness of the insulating resin film.   
     
     
         7 . A method for producing a bonded structure, comprising:
 arranging a substrate containing an electrode, an electronic part containing stud bumps, and an insulating resin film so that the electrode of the substrate and the stud bumps of the electronic parts are faced each other via the insulating resin film, and heating and pressing the substrate and the electronic part to thereby bond the substrate and the electronic part together,   wherein the insulating resin film contains:   a first adhesive layer; and   a second adhesive layer,   wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part,   wherein the first adhesive layer and the second adhesive layer each contain inorganic filler,   wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and   wherein the first adhesive layer has a thickness that is 50% to 90% of a total thickness of the insulating resin film.