Inventor · disambiguated record
Ryutaro Suda
Also filed as: SUDA RYUTARO
16 granted patents·13 pending applications·5 citations·filing 2020–2025
86Inventor score
Files withTOKYO ELECTRON LTD29
Top patents by PatentIndex Score
29 records- 0196US11551937B2Etching methodTOKYO ELECTRON LTD·Filed 2022·Granted Jan 10, 2023·2 cites·36 claims
- 0295US11615964B2Etching methodTOKYO ELECTRON LTD·Filed 2022·Granted Mar 28, 2023·2 cites·30 claims
- 0384US11361976B2Substrate processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jun 14, 2022·1 cites·20 claims
- 0484US2025046615A1Etching methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0582US12142484B2Etching methodTOKYO ELECTRON LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 0673US2022285169A1Substrate processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0773US2025323055A1Etching methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0872US11342194B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted May 24, 2022·0 cites·39 claims
- 0972US2022246443A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1070US12512325B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2023·Granted Dec 30, 2025·0 cites·16 claims
- 1169US2023207343A1Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1265US11600501B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 1365US2023268191A1Etching methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1462US12341020B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Jun 24, 2025·0 cites·22 claims
- 1560US12198938B2Etching methodTOKYO ELECTRON LTD·Filed 2021·Granted Jan 14, 2025·0 cites·17 claims
- 1659US12368027B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Jul 22, 2025·0 cites·15 claims
- 1756US11482425B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Oct 25, 2022·0 cites·19 claims
- 1856US11171012B1Method and apparatus for formation of protective sidewall layer for bow reductionTOKYO ELECTRON LTD·Filed 2020·Granted Nov 9, 2021·0 cites·18 claims
- 1956US11094550B2Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Aug 17, 2021·0 cites·16 claims
- 2055US2023215700A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2155US2023223249A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 2254US2022389584A1Shower head, electrode unit, gas supply unit, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2352US11456180B2Etching methodTOKYO ELECTRON LTD·Filed 2020·Granted Sep 27, 2022·0 cites·22 claims
- 2450US11996296B2Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted May 28, 2024·0 cites·16 claims
- 2549US12347651B2Etching method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jul 1, 2025·0 cites·19 claims
- 2648US2022051899A1Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 2747US2021343539A1Substrate processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 2847US2025191889A1Plasma processing apparatus and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2946US2024038494A1Etching method and etching apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →