Inventor · disambiguated record
Ryojiro Tominaga
Also filed as: TOMINAGA RYOJIRO
24 granted patents·9 pending applications·68 citations·filing 2009–2022
93Inventor score
Top patents by PatentIndex Score
33 records- 0191US8586875B2Wiring board and method for manufacturing the sameMORITA HARUHIKO·Filed 2010·Granted Nov 19, 2013·27 cites·18 claims
- 0287US9832878B2Wiring board with cavity for built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Nov 28, 2017·5 cites·20 claims
- 0386US8541695B2Wiring board and method for manufacturing the sameISHIDA ATSUSHI·Filed 2010·Granted Sep 24, 2013·8 cites·12 claims
- 0479US8624127B2Wiring board and method for manufacturing the sameISHIDA ATSUSHI·Filed 2010·Granted Jan 7, 2014·4 cites·20 claims
- 0577US8901431B2Printed wiring board and method for manufacturing printed wiring boardNISHIOKA HIROYUKI·Filed 2011·Granted Dec 2, 2014·6 cites·20 claims
- 0676US11849545B2Circuit formation methodFUJI CORP·Filed 2018·Granted Dec 19, 2023·2 cites·9 claims
- 0776US9232638B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Granted Jan 5, 2016·5 cites·20 claims
- 0870US9723728B2Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Aug 1, 2017·2 cites·20 claims
- 0968US8729405B2Wiring board and method for manufacturing the sameISHIDA ATSUSHI·Filed 2011·Granted May 20, 2014·2 cites·19 claims
- 1066US9613893B2Wiring substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Apr 4, 2017·2 cites·20 claims
- 1164US8826530B2Method for manufacturing substrate with metal filmNIKI AYAO·Filed 2010·Granted Sep 9, 2014·2 cites·21 claims
- 1262US12245378B2Three-dimensional molding machineFUJI CORP·Filed 2019·Granted Mar 4, 2025·0 cites·9 claims
- 1360US12369259B2Circuit forming methodFUJI CORP·Filed 2020·Granted Jul 22, 2025·0 cites·6 claims
- 1459US8563873B2Substrate with metal film and method for manufacturing the sameNIKI AYAO·Filed 2009·Granted Oct 22, 2013·1 cites·20 claims
- 1558US12096570B2Wiring formation methodFUJI CORP·Filed 2020·Granted Sep 17, 2024·0 cites·12 claims
- 1658US9117730B2Printed wiring board and method for manufacturing printed wiring boardTOMINAGA RYOJIRO·Filed 2012·Granted Aug 25, 2015·1 cites·20 claims
- 1757US9226409B2Method for manufacturing a wiring boardIBIDEN CO LTD·Filed 2013·Granted Dec 29, 2015·0 cites·7 claims
- 1856US2024390985A1Circuit forming method and information processing deviceFUJI CORP·Filed 2021·Application pending·0 cites
- 1955US2025153430A1Shaping method and shaping deviceFUJI CORP·Filed 2022·Application pending·0 cites
- 2054US11945886B2Cured resin formation method and cured resin formation deviceFUJI CORP·Filed 2019·Granted Apr 2, 2024·0 cites·4 claims
- 2154US11540397B2Printed substrate forming methodFUJI CORP·Filed 2018·Granted Dec 27, 2022·0 cites·6 claims
- 2253US9520222B2Wiring board and method for manufacturing wiring boardIBIDEN CO LTD·Filed 2013·Granted Dec 13, 2016·1 cites·16 claims
- 2352US11458722B2Three-dimensional multi-layer electronic device production methodFUJI CORP·Filed 2017·Granted Oct 4, 2022·0 cites·5 claims
- 2450US2025261317A1Manufacturing method and manufacturing deviceFUJI CORP·Filed 2022·Application pending·0 cites
- 2548US12119327B2Method for manufacturing stack componentsFUJI CORP·Filed 2019·Granted Oct 15, 2024·0 cites·10 claims
- 2647US12151438B2Image processing device, image processing method, and computer readable medium that process an image in which a wiring pattern is drawn and outputs the image as raster dataFUJI CORP·Filed 2019·Granted Nov 26, 2024·0 cites·7 claims
- 2742US2013192879A1Multilayer printed wiring boardMORITA HARUHIKO·Filed 2012·Application pending·0 cites
- 2839US12048102B2Electronic circuit production method using 3D layer shapingFUJI CORP·Filed 2019·Granted Jul 23, 2024·0 cites·5 claims
- 2938US2011048775A1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2010·Application pending·0 cites
- 3038US2022240378A1Multilayer circuit substrate and method for manufacturing the sameFUJI CORP·Filed 2019·Application pending·0 cites
- 3136US2016073515A1Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 3234US2016095219A1Printed wiring board and semiconductor device having the sameIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 3332US2021267054A1Circuit formation method and circuit formation deviceFUJI CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →