Inventor · disambiguated record
Ryuji Yamamoto
Also filed as: YAMAMOTO RYUJI
75 granted patents·35 pending applications·578 citations·filing 1976–2025
99Inventor score
Files withSHOWA DENKO KK26HITACHI INT ELECTRIC INC18NIPPON TELEGRAPH & TELEPHONE14KOKUSAI ELECTRIC CORP8YAMAMOTO RYUJI8
Top patents by PatentIndex Score
110 records- 0197US11145505B1Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Oct 12, 2021·5 cites·23 claims
- 0297US7681128B2Multimedia player and method of displaying on-screen menuSONY CORP·Filed 2005·Granted Mar 16, 2010·80 cites·20 claims
- 0394US8201104B2Content player and method of displaying on-screen menuYAMAMOTO RYUJI·Filed 2005·Granted Jun 12, 2012·59 cites·10 claims
- 0493US6974627B2Fine carbon fiber mixture and composition thereofNAT INST OF ADVANCED IND SCIEN·Filed 2002·Granted Dec 13, 2005·41 cites·18 claims
- 0592US9613798B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Apr 4, 2017·8 cites·13 claims
- 0692US7122132B2Branched vapor-grown carbon fiber, electrically conductive transparent composition and use thereofSHOWA DENKO KK·Filed 2001·Granted Oct 17, 2006·34 cites·23 claims
- 0789US9165761B2Method for manufacturing semiconductor device, method for processing substrate, substrate processing apparatus and recording mediumHIROSE YOSHIRO·Filed 2012·Granted Oct 20, 2015·9 cites·20 claims
- 0888US6844061B2Fine carbon fiber and composition thereofSHOWA DENKO KK·Filed 2002·Granted Jan 18, 2005·35 cites·10 claims
- 0987US9187826B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 17, 2015·6 cites·19 claims
- 1087US8822350B2Method of manufacturing semiconductor device, substrate processing method and substrate processing apparatusYUASA KAZUHIRO·Filed 2011·Granted Sep 2, 2014·8 cites·15 claims
- 1187US7885472B2Information processing apparatus enabling an efficient parallel processingSONY COMPUTER ENTERTAINMENT INC·Filed 2007·Granted Feb 8, 2011·16 cites·5 claims
- 1286US9558937B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jan 31, 2017·4 cites·20 claims
- 1385US7718018B2Method of cooling steel plateNIPPON STEEL CORP·Filed 2007·Granted May 18, 2010·6 cites·3 claims
- 1484US7981358B2Cooling apparatus of hot steel plate, cooling method of hot steel plate, and programNIPPON STEEL CORP·Filed 2007·Granted Jul 19, 2011·6 cites·2 claims
- 1583US7891975B2Heat treatment apparatus and method of manufacturing substrateHITACHI INT ELECTRIC INC·Filed 2005·Granted Feb 22, 2011·9 cites·14 claims
- 1683US6730398B2Fine carbon and method for producing the sameSHOWA DENKO KK·Filed 2002·Granted May 4, 2004·21 cites·14 claims
- 1782US9890458B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Feb 13, 2018·3 cites·19 claims
- 1882US9390911B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Granted Jul 12, 2016·5 cites·17 claims
- 1982US9177786B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Nov 3, 2015·5 cites·13 claims
- 2081US8012406B2Method of arranging and setting spray cooling nozzles and hot steel plate cooling apparatusNIPPON STEEL CORP·Filed 2007·Granted Sep 6, 2011·4 cites·3 claims
- 2181US7585434B2Carbonaceous material for forming electrically conductive material and use thereofSHOWA DENKO KK·Filed 2003·Granted Sep 8, 2009·27 cites·20 claims
- 2281US7390593B2Fine carbon fiber, method for producing the same and use thereofSHOWA DENKO KK·Filed 2002·Granted Jun 24, 2008·22 cites·20 claims
- 2380US10329107B2Conveying apparatusBROTHER IND LTD·Filed 2018·Granted Jun 25, 2019·2 cites·15 claims
- 2479US9397340B2Composite carbon fibersSHOWA DENKO KK·Filed 2013·Granted Jul 19, 2016·2 cites·18 claims
- 2578US9524867B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Dec 20, 2016·2 cites·15 claims
- 2678US2024287671A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2777US9234277B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jan 12, 2016·3 cites·13 claims
- 2877US8206678B2Vapor grown carbon fiber, production method thereof and composite material containing the carbon fiberYANO KOTARO·Filed 2005·Granted Jun 26, 2012·2 cites·13 claims
- 2977US7150840B2Graphite fine carbon fiber, and production method and use thereofSHOWA DENKO KK·Filed 2003·Granted Dec 19, 2006·36 cites·22 claims
- 3076US9085810B2Cooling apparatus of thick-gauge steel plateSERIZAWA YOSHIHIRO·Filed 2013·Granted Jul 21, 2015·2 cites·3 claims
- 3175US8653177B2Semiconductive resin compositionNAGAO YUJI·Filed 2007·Granted Feb 18, 2014·4 cites·25 claims
- 3275US8508200B2Power supply circuit using amplifiers and current voltage converter for improving ripple removal rate and differential balanceYAMAMOTO RYUJI·Filed 2010·Granted Aug 13, 2013·6 cites·2 claims
- 3375US2025283215A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3474US9337491B2Electrode for a lithium battery and lithium batteryYAMAMOTO RYUJI·Filed 2012·Granted May 10, 2016·2 cites·8 claims
- 3573US12331393B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jun 17, 2025·0 cites·23 claims
- 3673US9587308B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 7, 2017·2 cites·16 claims
- 3771US12037677B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 16, 2024·0 cites·21 claims
- 3871US9865458B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jan 9, 2018·1 cites·12 claims
- 3970US8084121B2Fine carbon fiber with linearity and resin composite material using the sameYONETAKE KOICHIRO·Filed 2004·Granted Dec 27, 2011·11 cites·13 claims
- 4070US7569161B2Electrically conducting polymer and production method and use thereofSHOWA DENKO KK·Filed 2004·Granted Aug 4, 2009·7 cites·15 claims
- 4169US7528859B2Electrophotographic image forming apparatusCANON KK·Filed 2007·Granted May 5, 2009·3 cites·4 claims
- 4268US9384961B2Method for manufacturing semiconductor device, method for processing substrate, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·1 cites·18 claims
- 4368US9114992B2Carbon fibers, catalyst for production of carbon fibers, and method for evaluation of carbon fibersSHOWA DENKO KK·Filed 2013·Granted Aug 25, 2015·1 cites·20 claims
- 4467US8246749B2Substrate processing apparatus and semiconductor device producing methodWANG JIE·Filed 2006·Granted Aug 21, 2012·2 cites·18 claims
- 4567US7879442B2Composite of vapor grown carbon fiber and inorganic fine particle and use thereofSHOWA DENKO KK·Filed 2004·Granted Feb 1, 2011·2 cites·15 claims
- 4667US2025379060A1Etching method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4765US9978587B2Method of manufacturing semiconductor device including forming a film containing a first element, a second element and carbon, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted May 22, 2018·1 cites·14 claims
- 4864US9741556B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 22, 2017·1 cites·18 claims
- 4964US7668490B2Developing apparatus having developer supplying member in spaced apart relationship with developer carrying memberCANON KK·Filed 2006·Granted Feb 23, 2010·2 cites·3 claims
- 5064US2022262632A1Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
Showing the top 50 of 110 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →