Inventor · disambiguated record
Sanghoon Ahn
Also filed as: AHN SANGHOON
46 granted patents·13 pending applications·159 citations·filing 2011–2024
97Inventor score
Files withSAMSUNG ELECTRONICS CO LTD43SAMSUNG DISPLAY CO LTD6HAN KYU-HEE3ITM SEMICONDUCTOR CO LTD3RHA SANGHO2
Top patents by PatentIndex Score
59 records- 0197US11515201B2Integrated circuit device including air gaps and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 29, 2022·5 cites·20 claims
- 0296US11569128B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·3 cites·20 claims
- 0396US9953924B2Semiconductor devices including a capping layerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 24, 2018·10 cites·20 claims
- 0496US9711453B2Semiconductor devices including a capping layerSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 18, 2017·12 cites·20 claims
- 0596US9368362B2Semiconductor devices including a capping layer and methods of forming semiconductor devices including a capping layerRHA SANGHO·Filed 2014·Granted Jun 14, 2016·42 cites·20 claims
- 0694US10269712B2Semiconductor devices including a capping layerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
- 0793US9666525B2Three-dimensional semiconductor memory deviceKIM JEEYONG·Filed 2016·Granted May 30, 2017·16 cites·20 claims
- 0889US9929099B2Planarized interlayer dielectric with air gap isolationSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 27, 2018·7 cites·15 claims
- 0989US9842803B2Semiconductor devices including gaps between conductive patternsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 12, 2017·5 cites·20 claims
- 1088US11069613B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 20, 2021·3 cites·20 claims
- 1188US9524937B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 20, 2016·7 cites·20 claims
- 1287US9460922B1Laser annealing apparatus and a method for manufacturing a display apparatus using the laser annealing apparatusSAMSUNG DISPLAY CO LTD·Filed 2015·Granted Oct 4, 2016·6 cites·12 claims
- 1384US12243777B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1484US8786058B2Semiconductor devices and methods of manufacturing the sameHAN KYU-HEE·Filed 2011·Granted Jul 22, 2014·8 cites·14 claims
- 1583US10566284B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 18, 2020·4 cites·20 claims
- 1682US9969047B2Substrate polishing apparatusSAMSUNG DISPLAY CO LTD·Filed 2016·Granted May 15, 2018·2 cites·17 claims
- 1781US9337150B2Semiconductor devices including supporting patterns in gap regions between conductive patternsHAN KYU-HEE·Filed 2013·Granted May 10, 2016·4 cites·27 claims
- 1880US9343409B2Semiconductor devices having staggered air gapsRHA SANGHO·Filed 2015·Granted May 17, 2016·3 cites·17 claims
- 1979US11823952B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 2079US9972528B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 15, 2018·3 cites·20 claims
- 2177US9520300B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 13, 2016·2 cites·20 claims
- 2276US10943824B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 9, 2021·1 cites·20 claims
- 2375US10263238B2Battery protection circuit module package, battery pack and electronic device including sameITM SEMICONDUCTOR CO LTD·Filed 2014·Granted Apr 16, 2019·7 cites·11 claims
- 2475US9633845B2Method of manufacturing a substrate having a crystallized layer and a laser crystallizing apparatus for the sameSAMSUNG DISPLAY CO LTD·Filed 2015·Granted Apr 25, 2017·2 cites·15 claims
- 2575US2024395613A1Method of forming interconnect structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2673US2025014998A1Semiconductor integrated circuit device suppressing leakage current of multilayer wiring structuresSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2771US11862514B2Integrated circuit device including air gaps and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 2870US11723285B2Variable resistance memory device having an anti-oxidation layer and a method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 8, 2023·0 cites·20 claims
- 2969US12080595B2Method of forming interconnect structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·25 claims
- 3065US11296277B2Variable resistance memory device having an anti-oxidation layer and a method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 5, 2022·0 cites·16 claims
- 3165US10707164B2Semiconductor devices including a capping layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 7, 2020·0 cites·19 claims
- 3265US9387552B2Laser annealing apparatus and laser annealing method using the sameSAMSUNG DISPLAY CO LTD·Filed 2015·Granted Jul 12, 2016·1 cites·20 claims
- 3364US12125785B2Semiconductor integrated circuit device suppressing leakage current of multilayer wiring structuresSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 3463US2025126835A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3559US2025316473A1Method of depositing thin layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3659US2024421070A1Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3758US2025259885A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3858US2024096796A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3957US10497647B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 3, 2019·0 cites·20 claims
- 4057US10141258B2Semiconductor devices having staggered air gapsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 27, 2018·0 cites·11 claims
- 4154US9748170B2Semiconductor devices having staggered air gapsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 29, 2017·0 cites·14 claims
- 4253US11721622B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 4353US9911644B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 6, 2018·0 cites·12 claims
- 4453US2024411227A1Photolithography method and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4553US2024421206A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4652US9741608B2Methods of fabricating semiconductor devices including supporting patterns in gap regions between conductive patternsHAN KYU-HEE·Filed 2016·Granted Aug 22, 2017·0 cites·20 claims
- 4752US2023170376A1Image sensor and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4851US11837618B1Image sensor including a protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 5, 2023·0 cites·20 claims
- 4950US10186485B2Planarized interlayer dielectric with air gap isolationSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 22, 2019·0 cites·20 claims
- 5050US9786499B2Method of manufacturing a substrate having a crystallized layer and a laser crystallizing apparatus for the sameSAMSUNG DISPLAY CO LTD·Filed 2017·Granted Oct 10, 2017·0 cites·5 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Sanghoon Ahn files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →