Inventor · disambiguated record

Say Teow Chan

Also filed as: CHAN SAY TEOW

0 granted patents·2 pending applications·0 citations·filing 2007–2012

Technology areasH10W

Files withCHAN SAY TEOW1 KWAN YIU FAI1

Top patents by PatentIndex Score

2 records

0139US2008174981A1Pre-molded lead frame and process for manufacturing the sameCHAN SAY TEOW·Filed 2007·Application pending·0 cites
0230US2013098659A1Pre-plated lead frame for copper wire bondingKWAN YIU FAI·Filed 2012·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →