Inventor · disambiguated record

Sao-Ling Chiu

Also filed as: CHIU SAO-LING

40 granted patents·9 pending applications·596 citations·filing 2004–2025

97Inventor score

Technology areasH10W H10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD41 TAIWAN SEMICONDUCTOR MFG3 LIU YU-CHIH2 UNITIVE ELECTRONICS INC1 UNITIVE INT LTD1

Top patents by PatentIndex Score

49 records

0199US8802504B13D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·408 cites·20 claims
0298US11728254B2Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·11 cites·20 claims
0396US11373946B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
0495US11545438B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·12 cites·20 claims
0595US9633869B2Packages with interposers and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 25, 2017·15 cites·20 claims
0695US9048231B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 2, 2015·13 cites·20 claims
0792US11967546B2Giga interposer integration through Chip-On-Wafer-On-SubstrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 23, 2024·1 cites·20 claims
0892US10529679B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 7, 2020·6 cites·20 claims
0991US11728278B2Board substrates, three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 15, 2023·6 cites·20 claims
1091US11302600B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 12, 2022·5 cites·19 claims
1191US8288208B1Apparatus and methods for semiconductor packages with improved warpageLIU YU-CHIH·Filed 2011·Granted Oct 16, 2012·17 cites·15 claims
1288US11552054B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 10, 2023·2 cites·20 claims
1387US7579694B2Electronic devices including offset conductive bumpsUNITIVE INT LTD·Filed 2006·Granted Aug 25, 2009·19 cites·19 claims
1486US12283541B2Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 22, 2025·0 cites·20 claims
1586US11107758B2Fan-out package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·2 cites·20 claims
1686US9824902B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 21, 2017·5 cites·11 claims
1786US7081404B2Methods of selectively bumping integrated circuit substrates and related structuresUNITIVE ELECTRONICS INC·Filed 2004·Granted Jul 25, 2006·56 cites·51 claims
1884US10163770B2Fan-out package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·2 cites·20 claims
1984US9984981B2Packages with interposers and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 29, 2018·3 cites·20 claims
2084US8836094B1Package device including an opening in a flexible substrate and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 16, 2014·7 cites·19 claims
2184US2025069980A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2281US12170237B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
2381US2024222242A1Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2481US2025218922A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2580US10978346B2Conductive vias in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
2679US11916009B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·20 claims
2779US2024371782A1Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2878US12113027B2Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
2978US11901306B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
3078US2025343192A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3176US11715681B2Fan-out package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·0 cites·20 claims
3276US11715675B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 1, 2023·0 cites·20 claims
3375US2025336833A1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3473US2025149486A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3571US11810793B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
3671US11502043B2Semiconductor structure and method for fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
3771US10510603B2Conductive vias in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·1 cites·20 claims
3868US12431435B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
3968US10854567B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
4064US10978404B2Semiconductor structure and method for fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
4164US10510648B2Fan-out package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
4262US11495472B2Semicondutor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
4361US2025210461A1Packages with double-side metal pillars and the methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4458US11152312B2Packages with interposers and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 19, 2021·0 cites·20 claims
4558US9953911B2Fan-out package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 24, 2018·0 cites·20 claims
4653US9581638B2Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·19 claims
4752US9786567B2Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 10, 2017·0 cites·20 claims
4841US2013241057A1Methods and Apparatus for Direct Connections to Through ViasYU CHEN-HUA·Filed 2012·Application pending·0 cites
4939US8993378B2Flip-chip BGA assembly processLIU YU-CHIH·Filed 2011·Granted Mar 31, 2015·0 cites·14 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →