Inventor · disambiguated record
Sam Chung
Also filed as: CHUNG SAM · CHUNG SAM WON
3 granted patents·97 citations·filing 1980–2001
74Inventor score
Top patents by PatentIndex Score
3 records- 0186US6414501B2Micro cantilever style contact pin structure for wafer probingAMST CO LTD·Filed 2001·Granted Jul 2, 2002·62 cites·20 claims
- 0256US5705432AProcess for providing clean lift-off of sputtered thin film layersHUGHES AIRCRAFT CO·Filed 1995·Granted Jan 6, 1998·24 cites·14 claims
- 0352US4317700AMethod of fabrication of planar bubble domain device structuresROCKWELL INTERNATIONAL CORP·Filed 1980·Granted Mar 2, 1982·11 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →