Inventor · disambiguated record
Sandeep Gaan
Also filed as: GAAN SANDEEP
16 granted patents·12 pending applications·42 citations·filing 2013–2024
90Inventor score
Top patents by PatentIndex Score
28 records- 0192US9123771B2Shallow trench isolation integration methods and devices formed therebyGLOBALFOUNDRIES INC·Filed 2013·Granted Sep 1, 2015·13 cites·19 claims
- 0291US11443885B2Thin film barrier seed metallization in magnetic-plugged through hole inductorINTEL CORP·Filed 2018·Granted Sep 13, 2022·4 cites·12 claims
- 0388US11387175B2Interposer package-on-package (PoP) with solder array thermal contactsINTEL CORP·Filed 2018·Granted Jul 12, 2022·6 cites·16 claims
- 0483US9224842B2Patterning multiple, dense features in a semiconductor device using a memorization layerGLOBALFOUNDRIES INC·Filed 2014·Granted Dec 29, 2015·5 cites·16 claims
- 0582US9385192B2Shallow trench isolation integration methods and devices formed therebyGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 5, 2016·3 cites·7 claims
- 0677US9831098B2Methods for fabricating integrated circuits using flowable chemical vapor deposition techniques with low-temperature thermal annealingGLOBALFOUNDRIES INC·Filed 2015·Granted Nov 28, 2017·3 cites·20 claims
- 0777US9520395B2FinFET devices comprising a dielectric layer/CMP stop layer/hardmask/etch stop layer/gap-fill material stackGLOBALFOUNDRIES INC·Filed 2015·Granted Dec 13, 2016·2 cites·8 claims
- 0877US8940650B2Methods for fabricating integrated circuits utilizing silicon nitride layersGLOBALFOUNDRIES INC·Filed 2013·Granted Jan 27, 2015·4 cites·19 claims
- 0971US9076645B1Method of fabricating an interlayer structure of increased elasticity modulusGLOBALFOUNDRIES INC·Filed 2014·Granted Jul 7, 2015·2 cites·20 claims
- 1059US2025298202A1Technologies for bridge dies for optical interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 1158US2025219032A1Technologies for back side micro-led assembliesDUONG BENJAMIN T·Filed 2023·Application pending·0 cites
- 1255US2024345324A1Optical fiber mounts for printed circuit boards and integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1355US2025110289A1Optical connector ferruleINTEL CORP·Filed 2023·Application pending·0 cites
- 1454US2024176167A1Integrated optical phase change materials for reconfigurable optics in glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 1552US2024111093A1Glass recirculator for optical signal rerouting across photonic integrated circuitsINTEL CORP·Filed 2022·Application pending·0 cites
- 1650US2025216636A1Optical bridge for photonic interposer to photonic interposer communicationsINTEL CORP·Filed 2022·Application pending·0 cites
- 1749US11037802B2Package substrate having copper alloy sputter seed layer and high density interconnectsINTEL CORP·Filed 2016·Granted Jun 15, 2021·0 cites·20 claims
- 1849US9502232B2Inhibiting diffusion of elements between material layers of a layered circuit structureGLOBALFOUNDRIES INC·Filed 2014·Granted Nov 22, 2016·0 cites·20 claims
- 1949US2023093438A1Glass substrate embedded pic to pic and off-chip photonic communicationsINTEL CORP·Filed 2021·Application pending·0 cites
- 2048US2022373734A1Integrated circuit package interposers with photonic & electrical routingINTEL CORP·Filed 2021·Application pending·0 cites
- 2147US9184288B2Semiconductor structures with bridging films and methods of fabricationGLOBALFOUNDRIES INC·Filed 2014·Granted Nov 10, 2015·0 cites·20 claims
- 2244US9466701B2Processes for preparing integrated circuits with improved source/drain contact structures and integrated circuits prepared according to such processesGLOBALFOUNDRIES INC·Filed 2014·Granted Oct 11, 2016·0 cites·18 claims
- 2341US11291122B2Apparatus with a substrate provided with plasma treatmentINTEL CORP·Filed 2017·Granted Mar 29, 2022·0 cites·14 claims
- 2438US9570291B2Semiconductor substrates and methods for processing semiconductor substratesGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 14, 2017·0 cites·14 claims
- 2538US2019206786A1Thin film passive devices integrated in a package substrateINTEL CORP·Filed 2017·Application pending·0 cites
- 2638US2019006457A1Package integrated passivesINTEL CORP·Filed 2017·Application pending·0 cites
- 2737US9673039B2Devices comprising high-K dielectric layer and methods of forming sameGLOBALFOUNDRIES INC·Filed 2015·Granted Jun 6, 2017·0 cites·12 claims
- 2834US2018040505A1Method for forming a shallow trench isolation structure using a nitride liner and a diffusionless annealGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →