Inventor · disambiguated record
Satoshi Genda
Also filed as: GENDA SATOSHI
9 granted patents·9 pending applications·216 citations·filing 2004–2023
88Inventor score
Files withDISCO CORP16
Top patents by PatentIndex Score
18 records- 0196US7179723B2Wafer processing methodDISCO CORP·Filed 2004·Granted Feb 20, 2007·138 cites·7 claims
- 0292US7544588B2Laser processing method for waferDISCO CORP·Filed 2006·Granted Jun 9, 2009·21 cites·2 claims
- 0391US7915140B2Fabrication method for device having die attach film on the back side thereofDISCO CORP·Filed 2009·Granted Mar 29, 2011·22 cites·1 claims
- 0486US7557904B2Wafer holding mechanismDISCO CORP·Filed 2006·Granted Jul 7, 2009·12 cites·5 claims
- 0581US9530695B2Wafer processing methodDISCO CORP·Filed 2014·Granted Dec 27, 2016·5 cites·2 claims
- 0680US7459378B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Dec 2, 2008·7 cites·3 claims
- 0768US7642485B2Laser beam processing machineDISCO CORP·Filed 2006·Granted Jan 5, 2010·2 cites·1 claims
- 0862US7087857B2Method of dividing a workpiece in the form of a plate having a layer and a substrate made of different materialsDISCO CORP·Filed 2004·Granted Aug 8, 2006·9 cites·2 claims
- 0962US2023249311A1Surface irregularity reducing method and surface irregularity reducing apparatusDISCO CORP·Filed 2023·Application pending·0 cites
- 1054US2023321871A1Wafer manufacturing methodDISCO CORP·Filed 2023·Application pending·0 cites
- 1152US2022410305A1Facet region detection method and wafer generation methodDISCO CORP·Filed 2022·Application pending·0 cites
- 1246US2008115891A1Laser beam machining systemDISCO CORP·Filed 2007·Application pending·0 cites
- 1341US2006009008A1Method for the laser processing of a waferDISCO CORP·Filed 2005·Application pending·0 cites
- 1441US2006148211A1Wafer dividing methodDISCO CORP·Filed 2006·Application pending·0 cites
- 1540US2006045511A1Wafer dividing methodDISCO CORP·Filed 2005·Application pending·0 cites
- 1639US2005101108A1Semiconductor wafer dividing methodFiled 2004·Application pending·0 cites
- 1738US2005035100A1Method of dividing a plate-like workpieceFiled 2004·Application pending·0 cites
- 1836US11433487B2Method of processing workpieceDISCO CORP·Filed 2020·Granted Sep 6, 2022·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →