Inventor · disambiguated record
Sayuri Hada
Also filed as: HADA SAYURI
12 granted patents·3 pending applications·32 citations·filing 2007–2024
85Inventor score
Top patents by PatentIndex Score
15 records- 0187US9179579B2Sheet having high thermal conductivity and flexibilityHADA SAYURI·Filed 2007·Granted Nov 3, 2015·26 cites·8 claims
- 0279US10595399B2Method of reducing warpage of an organic substrateIBM·Filed 2018·Granted Mar 17, 2020·2 cites·8 claims
- 0376US2025062275A1Injection molded solder head with improved sealing performanceIBM·Filed 2024·Application pending·0 cites
- 0470US10325839B2Reduction of stress in via structureIBM·Filed 2017·Granted Jun 18, 2019·1 cites·18 claims
- 0568US12166008B2Injection molded solder head with improved sealing performanceIBM·Filed 2021·Granted Dec 10, 2024·0 cites·18 claims
- 0667US9672323B2Reduction of warpage of multilayered substrate or packageIBM·Filed 2016·Granted Jun 6, 2017·1 cites·10 claims
- 0764US10074583B2Circuit module and manufacturing method thereofIBM·Filed 2015·Granted Sep 11, 2018·1 cites·12 claims
- 0863US9384314B2Reduction of warpage of multilayered substrate or packageIBM·Filed 2014·Granted Jul 5, 2016·1 cites·8 claims
- 0956US10679916B2Circuit module and manufacturing method thereofIBM·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 1056US10593616B2Reduction of stress in via structureTESSERA INC·Filed 2017·Granted Mar 17, 2020·0 cites·20 claims
- 1156US2019214339A1Reduction of stress in via structureIBM·Filed 2019·Application pending·0 cites
- 1253US9967971B2Method of reducing warpage of an orgacnic substrateIBM·Filed 2015·Granted May 8, 2018·0 cites·7 claims
- 1347US9099315B2Mounting structure and mounting structure manufacturing methodIBM·Filed 2014·Granted Aug 4, 2015·0 cites·8 claims
- 1443US9568405B2Method, apparatus, and structure for determining interposer thicknessIBM·Filed 2014·Granted Feb 14, 2017·0 cites·13 claims
- 1541US2013119536A1Method for forming studs used for self-alignment of solder bumpsIBM·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →