Inventor · disambiguated record
Sadayoshi Horii
Also filed as: HORII SADAYOSHI
28 granted patents·13 pending applications·144 citations·filing 2003–2023
95Inventor score
Files withHITACHI INT ELECTRIC INC22KOKUSAI ELECTRIC CORP7HORII SADAYOSHI6HARADA KAZUHIRO1HITACHI KOKUSAI ELECTRONIC INC1
Top patents by PatentIndex Score
41 records- 0194US7648578B1Substrate processing apparatus, and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Jan 19, 2010·30 cites·17 claims
- 0293US11869764B2Substrate processing apparatus, substrate processing method and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jan 9, 2024·1 cites·15 claims
- 0392US11476112B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Oct 18, 2022·6 cites·10 claims
- 0490US8026159B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Granted Sep 27, 2011·17 cites·8 claims
- 0585US8404603B2Method of manufacturing semiconductor device and substrate processing systemOGAWA ARITO·Filed 2010·Granted Mar 26, 2013·8 cites·20 claims
- 0684US8420552B2Method of manufacturing a semiconductor deviceTAKEBAYASHI YUJI·Filed 2010·Granted Apr 16, 2013·6 cites·2 claims
- 0782US12368043B2Substrate processing apparatus, processing method, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jul 22, 2025·0 cites·19 claims
- 0882US6787481B2Method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2003·Granted Sep 7, 2004·29 cites·17 claims
- 0980US9472637B2Semiconductor device having electrode made of high work function material and method of manufacturing the sameHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 18, 2016·3 cites·17 claims
- 1079US7579276B2Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Aug 25, 2009·3 cites·13 claims
- 1178US7968437B2Semiconductor device manufacturing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2006·Granted Jun 28, 2011·6 cites·16 claims
- 1274US8415237B2Method of manufacturing semiconductor device and substrate processing apparatusHORII SADAYOSHI·Filed 2011·Granted Apr 9, 2013·3 cites·14 claims
- 1372US10985017B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 20, 2021·1 cites·15 claims
- 1472US8435905B2Manufacturing method of semiconductor device, and substrate processing apparatusHORII SADAYOSHI·Filed 2006·Granted May 7, 2013·4 cites·13 claims
- 1570US6825126B2Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2003·Granted Nov 30, 2004·11 cites·20 claims
- 1669US12087598B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Sep 10, 2024·1 cites·17 claims
- 1769US7531467B2Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2005·Granted May 12, 2009·3 cites·3 claims
- 1866US9437704B2Semiconductor device having electrode made of high work function material, method and apparatus for manufacturing the sameHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 6, 2016·1 cites·11 claims
- 1965US8741731B2Method of manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2012·Granted Jun 3, 2014·1 cites·17 claims
- 2064US8728935B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusHARADA KAZUHIRO·Filed 2010·Granted May 20, 2014·2 cites·8 claims
- 2163US10604839B2Substrate processing apparatus, method of manufacturing semiconductor device, and method of processing substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Mar 31, 2020·1 cites·8 claims
- 2262US7723245B2Method for manufacturing semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2005·Granted May 25, 2010·1 cites·8 claims
- 2361US8685866B2Method of manufacturing semiconductor device and substrate processing apparatusHORII SADAYOSHI·Filed 2010·Granted Apr 1, 2014·1 cites·10 claims
- 2460US8580671B2Method of manufacturing semiconductor device and substrate processing apparatusHORII SADAYOSHI·Filed 2012·Granted Nov 12, 2013·1 cites·12 claims
- 2558US8193083B2Method of manufacturing semiconductor device and substrate processing apparatusHORII SADAYOSHI·Filed 2008·Granted Jun 5, 2012·1 cites·8 claims
- 2656US9653301B2Semiconductor device having electrode made of high work function material, method and apparatus for manufacturing the sameHITACHI INT ELECTRIC INC·Filed 2016·Granted May 16, 2017·0 cites·11 claims
- 2756US2023294145A1Gas cleaning method, method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2853US2023227979A1Substrate processing apparatus, method of manufacturing semiconductor device, method of processing substrate, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2950US11168396B2Method of manufacturing semiconductor device and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 9, 2021·0 cites·13 claims
- 3047US7524766B2Method for manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2003·Granted Apr 28, 2009·3 cites·3 claims
- 3147US2008286075A1Method for producing semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 3246US2011163452A1Semiconductor device, method of manufacturing semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2011·Application pending·0 cites
- 3343US2009233429A1Semiconductor device manufacturing method and substrate processing apparatusISHIKAWA DAI·Filed 2007·Application pending·0 cites
- 3442US2006035470A1Method for manufaturing semiconductor device and substrate processing systemHITACHI KOKUSAI ELECTRONIC INC·Filed 2003·Application pending·0 cites
- 3542US2009209095A1Manufacturing Method for Semiconductor Devices and Substrate Processing ApparatusHORII SADAYOSHI·Filed 2006·Application pending·0 cites
- 3641US2013075800A1Semiconductor device manufacturing method, semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2012·Application pending·0 cites
- 3740US2019003047A1Vaporizer and Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 3838US2007087579A1Semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2005·Application pending·0 cites
- 3937US2006240677A1Method for manufacturing semiconductor device and substrate processing apparatusSUSUMU HORITA·Filed 2003·Application pending·0 cites
- 4037US2011104896A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 4136US2010291763A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sadayoshi Horii files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →