Inventor · disambiguated record
Satoshi Isa
Also filed as: ISA SATOSHI
44 granted patents·11 pending applications·394 citations·filing 1995–2021
98Inventor score
Top patents by PatentIndex Score
55 records- 0198US10115709B1Apparatuses comprising semiconductor dies in face-to-face arrangementsMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 30, 2018·23 cites·18 claims
- 0297US7642635B2Stacked semiconductor packageELPIDA MEMORY INC·Filed 2006·Granted Jan 5, 2010·56 cites·13 claims
- 0393US11705432B2Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·2 cites·18 claims
- 0492US8426983B2Semiconductor deviceTAKEDA HIROMASA·Filed 2011·Granted Apr 23, 2013·19 cites·22 claims
- 0588US8243465B2Semiconductor device with additional power supply pathsITAYA SATOSHI·Filed 2010·Granted Aug 14, 2012·13 cites·15 claims
- 0688US7391113B2Semiconductor deviceELPIDA MEMORY INC·Filed 2006·Granted Jun 24, 2008·14 cites·11 claims
- 0787US7823096B2Inductance analysis system and method and program thereforELPIDA MEMORY INC·Filed 2006·Granted Oct 26, 2010·17 cites·9 claims
- 0885US7777350B2Semiconductor stack package having wiring extension part which has hole for wiringELPIDA MEMORY INC·Filed 2008·Granted Aug 17, 2010·13 cites·18 claims
- 0984US9418967B2Semiconductor devicePS4 LUXCO SARL·Filed 2013·Granted Aug 16, 2016·7 cites·6 claims
- 1081US7239169B2Semiconductor apparatus capable of preventing occurrence of multiple reflection, driving method, and setting method thereofELPIDA MEMORY INC·Filed 2002·Granted Jul 3, 2007·28 cites·14 claims
- 1181US5986943ASemiconductor memory device for shortening the set up time and hold time of control signals in synchronous DRAMNEC CORP·Filed 1996·Granted Nov 16, 1999·51 cites·7 claims
- 1274US7538431B2Semiconductor deviceELPIDA MEMORY INC·Filed 2008·Granted May 26, 2009·5 cites·13 claims
- 1373US11081468B2Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatusesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 3, 2021·1 cites·32 claims
- 1473US7569428B2Method for manufacturing semiconductor device, semiconductor device and apparatus comprising sameELPIDA MEMORY INC·Filed 2006·Granted Aug 4, 2009·6 cites·17 claims
- 1569US7875986B2Semiconductor deviceELPIDA MEMORY INC·Filed 2007·Granted Jan 25, 2011·4 cites·20 claims
- 1668US7667317B2Semiconductor package with bypass capacitorELPIDA MEMORY INC·Filed 2007·Granted Feb 23, 2010·4 cites·17 claims
- 1767US8569898B2Semiconductor deviceTAKEDA HIROMASA·Filed 2010·Granted Oct 29, 2013·2 cites·16 claims
- 1867US6977832B2Semiconductor memory device capable of improving quality of voltage waveform given in a signal interconnection layerELPIDA MEMORY INC·Filed 2002·Granted Dec 20, 2005·15 cites·25 claims
- 1966US7689944B2Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor packageELPIDA MEMORY INC·Filed 2006·Granted Mar 30, 2010·3 cites·65 claims
- 2065US8581417B2Semiconductor device stack with bonding layer and wire retaining memberHASEGAWA YU·Filed 2010·Granted Nov 12, 2013·2 cites·19 claims
- 2165US7956470B2Semiconductor deviceELPIDA MEMORY INC·Filed 2006·Granted Jun 7, 2011·3 cites·14 claims
- 2264US6094381ASemiconductor memory device with redundancy circuitNEC CORP·Filed 1998·Granted Jul 25, 2000·23 cites·6 claims
- 2363US9589921B2Semiconductor devicePS4 LUXCO SARL·Filed 2014·Granted Mar 7, 2017·1 cites·13 claims
- 2463US8970052B2Semiconductor device stack with bonding layer and wire retaining memberPS4 LUXCO SARL·Filed 2013·Granted Mar 3, 2015·1 cites·20 claims
- 2562US10600762B2Apparatuses comprising semiconductor dies in face-to-face arrangementsMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 24, 2020·0 cites·8 claims
- 2659US5798973ASemiconductor memory device having redundant memory cellsNEC CORP·Filed 1997·Granted Aug 25, 1998·18 cites·8 claims
- 2758US10431566B2Apparatuses comprising semiconductor dies in face-to-face arrangementsMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 1, 2019·0 cites·12 claims
- 2858US7681154B2Method for designing device, system for aiding to design device, and computer program product thereforELPIDA MEMORY INC·Filed 2007·Granted Mar 16, 2010·1 cites·47 claims
- 2957US7847377B2Semiconductor device including semiconductor chip with two pad rowsELPIDA MEMORY INC·Filed 2006·Granted Dec 7, 2010·1 cites·13 claims
- 3055US5677882ASemiconductor memory having redundancy memory decoder circuitNEC CORP·Filed 1995·Granted Oct 14, 1997·16 cites·5 claims
- 3153US5703824ASemiconductor memory deviceNEC CORP·Filed 1996·Granted Dec 30, 1997·14 cites·16 claims
- 3252US8796077B2Semiconductor deviceELPIDA MEMORY INC·Filed 2013·Granted Aug 5, 2014·0 cites·16 claims
- 3349US6075749ASemiconductor memory deviceNEC CORP·Filed 1998·Granted Jun 13, 2000·12 cites·11 claims
- 3449US2010095257A1Electromagnetic field analysis of semiconductor package with semiconductor chip mounted thereonELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 3548US6067271ASemiconductor memory device and a driving method of the sameNEC CORP·Filed 1998·Granted May 23, 2000·11 cites·12 claims
- 3647US7944026B2Semiconductor deviceELPIDA MEMORY INC·Filed 2007·Granted May 17, 2011·0 cites·13 claims
- 3747US2009250801A1Semiconductor deviceELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 3846US7816768B2Semiconductor device including ground and power-supply planes and a dielectric layer between the ground and power-supply planesELPIDA MEMORY INC·Filed 2008·Granted Oct 19, 2010·0 cites·15 claims
- 3944US2015318265A1Semiconductor devicePS4 LUXCO SARL·Filed 2013·Application pending·0 cites
- 4044US2013114223A1Semiconductor deviceITAYA SATOSHI·Filed 2012·Application pending·0 cites
- 4142US7694245B2Method for designing semiconductor package, system for aiding to design semiconductor package, and computer program product thereforELPIDA MEMORY·Filed 2007·Granted Apr 6, 2010·0 cites·48 claims
- 4242US2007164435A1Semiconductor deviceELPIDA MEMORY INC·Filed 2006·Application pending·0 cites
- 4341US5995432ASemiconductor memory device having N-channel MOS transistor for pulling up PMOS sources of sense amplifiersNEC CORP·Filed 1998·Granted Nov 30, 1999·7 cites·28 claims
- 4441US2004227222A1Stacked semiconductor packageELPIDA MEMORY INC·Filed 2004·Application pending·0 cites
- 4540US8587097B2Semiconductor device that suppresses malfunctions due to noise generated in internal circuitTAKEDA HIROMASA·Filed 2010·Granted Nov 19, 2013·0 cites·19 claims
- 4639US8063476B2Semiconductor deviceKOSHIISHI KAZUTAKA·Filed 2008·Granted Nov 22, 2011·0 cites·7 claims
- 4739US2005091440A1Memory system and memory moduleELPIDA MEMORY INC·Filed 2004·Application pending·0 cites
- 4838US2011084395A1Semiconductor package substrate and semiconductor device having the sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 4938US2010193929A1Semiconductor deviceELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 5036US2012146242A1Semiconductor device and method of fabricating the sameFUJISHIMA HIROYUKI·Filed 2011·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →