Inventor · disambiguated record
Sanjay Kamath
Also filed as: KAMATH SANJAY · KAMATH SANJAY G
19 granted patents·12 pending applications·956 citations·filing 2006–2025
92Inventor score
Top patents by PatentIndex Score
31 records- 0198US9362107B2Flowable low-k dielectric gapfill treatmentAPPLIED MATERIALS INC·Filed 2014·Granted Jun 7, 2016·430 cites·14 claims
- 0298US7967913B2Remote plasma clean process with cycled high and low pressure clean stepsAPPLIED MATERIALS INC·Filed 2009·Granted Jun 28, 2011·477 cites·19 claims
- 0393US10410869B2CVD based oxide-metal multi structure for 3D NAND memory devicesAPPLIED MATERIALS INC·Filed 2017·Granted Sep 10, 2019·8 cites·17 claims
- 0493US7799704B2Gas baffle and distributor for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2008·Granted Sep 21, 2010·15 cites·10 claims
- 0591US7740706B2Gas baffle and distributor for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2006·Granted Jun 22, 2010·19 cites·19 claims
- 0677US12451345B2PECVD of SiBN thin films with low leakage currentAPPLIED MATERIALS INC·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
- 0776US7704897B2HDP-CVD SiON films for gap-fillAPPLIED MATERIALS INC·Filed 2008·Granted Apr 27, 2010·7 cites·27 claims
- 0872US2024404823A1Plasma treatment process to densify oxide layersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0961US12094709B2Plasma treatment process to densify oxide layersAPPLIED MATERIALS INC·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 1060US2008124944A1Gas baffle and distributor for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1158US11817320B2CVD based oxide-metal multi structure for 3D NAND memory devicesAPPLIED MATERIALS INC·Filed 2019·Granted Nov 14, 2023·0 cites·20 claims
- 1257US2024090213A1Sacrificial layer for forming merged high aspect ratio contacts in 3d nand memory deviceAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1355US11600468B2Multi channel splitter spoolAPPLIED MATERIALS INC·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 1455US2025313948A1High-density plasma (hdp) topography improvement with partial gapfill carbonAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1554US11538677B2Systems and methods for depositing high density and high tensile stress filmsAPPLIED MATERIALS INC·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
- 1654US11217443B2Sequential deposition and high frequency plasma treatment of deposited film on patterned and un-patterned substratesAPPLIED MATERIALS INC·Filed 2019·Granted Jan 4, 2022·0 cites·20 claims
- 1754US2020211834A1Methods for forming films containing silicon boron with low leakage currentAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1853US12040210B2Multi-pressure bipolar electrostatic chuckingAPPLIED MATERIALS INC·Filed 2020·Granted Jul 16, 2024·0 cites·20 claims
- 1953US11430654B2Initiation modulation for plasma depositionAPPLIED MATERIALS INC·Filed 2019·Granted Aug 30, 2022·0 cites·20 claims
- 2052US11776835B2Power supply signal conditioning for an electrostatic chuckAPPLIED MATERIALS INC·Filed 2020·Granted Oct 3, 2023·0 cites·20 claims
- 2152US11270903B2Multi zone electrostatic chuckAPPLIED MATERIALS INC·Filed 2019·Granted Mar 8, 2022·0 cites·18 claims
- 2249US11817313B2Methods for pressure ramped plasma purgeAPPLIED MATERIALS INC·Filed 2020·Granted Nov 14, 2023·0 cites·17 claims
- 2346US11157661B2Process development visualization toolAPPLIED MATERIALS INC·Filed 2019·Granted Oct 26, 2021·0 cites·20 claims
- 2446US2024282605A1Louver design for eliminating line of sightAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2546US2021134592A1Surface encasing material layerAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2645US2021082732A1Repulsion mesh and deposition methodsAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2743US2022119952A1Method of reducing defects in a multi-layer pecvd teos oxide filmAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2842US10950430B2Pulsed plasma deposition etch step coverage improvementAPPLIED MATERIALS INC·Filed 2019·Granted Mar 16, 2021·0 cites·22 claims
- 2942US2022122811A1Electric arc mitigating faceplateAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3040US2013217241A1Treatments for decreasing etch rates after flowable deposition of silicon-carbon-and-nitrogen-containing layersUNDERWOOD BRIAN S·Filed 2012·Application pending·0 cites
- 3139US2018350563A1Quality improvement of films deposited on a substrateAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →