Inventor · disambiguated record
Sayoon Kang
Also filed as: KANG SAYOON
4 granted patents·2 pending applications·23 citations·filing 2005–2023
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0182US8105934B2Bump structure for a semiconductor device and method of manufactureKWON YONGHWAN·Filed 2009·Granted Jan 31, 2012·15 cites·11 claims
- 0280US9355931B2Package-on-package devices and methods of manufacturing the sameKIM JONGKOOK·Filed 2014·Granted May 31, 2016·8 cites·14 claims
- 0362US2023268241A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0453US11646241B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 9, 2023·0 cites·15 claims
- 0545US11205631B2Semiconductor package including multiple semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·18 claims
- 0639US2005233569A1Bump structure for a semiconductor device and method of manufactureKWON YONGHWAN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →