Inventor · disambiguated record
Sakae Kikuchi
Also filed as: KIKUCHI SAKAE
13 granted patents·4 pending applications·201 citations·filing 1974–2010
92Inventor score
Files withHITACHI LTD4HITACHI TOBU SEMICONDUCTOR LTD3NHK SPRING CO LTD2RENESAS TECH CORP2AKITA ELECTRONICS CO LTD1
Top patents by PatentIndex Score
17 records- 0193US3969754ASemiconductor device having supporting electrode composite structure of metal containing fibersHITACHI LTD·Filed 1974·Granted Jul 13, 1976·51 cites·19 claims
- 0288US6330165B1Semiconductor deviceHITACHI LTD·Filed 1999·Granted Dec 11, 2001·74 cites·25 claims
- 0382US7453147B2Semiconductor device, its manufacturing method, and radio communication deviceRENESAS TECH CORP·Filed 2006·Granted Nov 18, 2008·11 cites·30 claims
- 0477US7525813B2Semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Apr 28, 2009·6 cites·16 claims
- 0574US6489680B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Dec 3, 2002·15 cites·4 claims
- 0665US8546939B2RF module including control IC without the aid of a relay padSASAKI KENJI·Filed 2006·Granted Oct 1, 2013·4 cites·16 claims
- 0761US7068521B2Semiconductor deviceHITACHI TOBU SEMICONDUCTOR LTD·Filed 2005·Granted Jun 27, 2006·1 cites·10 claims
- 0858US4107727AResin sealed semiconductor deviceHITACHI LTD·Filed 1977·Granted Aug 15, 1978·20 cites·12 claims
- 0957US7262480B2Semiconductor device, and method and apparatus for manufacturing semiconductor deviceAKITA ELECTRONICS CO LTD·Filed 2001·Granted Aug 28, 2007·13 cites·6 claims
- 1053US7817437B2Semiconductor deviceRENENSAS ELECTRONICS CORP·Filed 2009·Granted Oct 19, 2010·0 cites·7 claims
- 1153US7119004B2Semiconductor device, its manufacturing method, and ratio communication deviceRENESAS E JP SEMICONDUCTOR INC·Filed 2002·Granted Oct 10, 2006·6 cites·22 claims
- 1250US2007001300A1Semiconductor deviceHITACHI TOBU SEMICONDUCTOR LTD·Filed 2006·Application pending·0 cites
- 1350US2009133785A1Leaf spring material and manufacturing method thereofNHK SPRING CO LTD·Filed 2008·Application pending·0 cites
- 1450US2009139615A1Leaf spring material and manufacturing method thereofNHK SPRING CO LTD·Filed 2008·Application pending·0 cites
- 1542US8295057B2Semiconductor deviceKOHJIRO IWAMICHI·Filed 2010·Granted Oct 23, 2012·0 cites·10 claims
- 1640US6943441B2Semiconductor deviceHITACHI TOBU SEMICONDUCTOR LTD·Filed 2002·Granted Sep 13, 2005·0 cites·16 claims
- 1733US2005248039A1Semiconductor deviceMIURA TOSHIHIRO·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →