Inventor · disambiguated record
Satoru Kudose
Also filed as: KUDOSE SATORU
6 granted patents·4 pending applications·7 citations·filing 2007–2014
72Inventor score
Top patents by PatentIndex Score
10 records- 0162US8129825B2IC chip package employing substrate with a device holeKUDOSE SATORU·Filed 2007·Granted Mar 6, 2012·3 cites·16 claims
- 0260US9632609B2Sensor sheet, sensor sheet module, touch sensor panel module, and electronic equipmentSHARP KK·Filed 2014·Granted Apr 25, 2017·1 cites·8 claims
- 0356US8193627B2IC chip mounting package provided with IC chip located in device hole formed within a package base memberKUDOSE SATORU·Filed 2007·Granted Jun 5, 2012·2 cites·16 claims
- 0455US8080823B2IC chip package and image display device incorporating sameKATOH TATSUYA·Filed 2007·Granted Dec 20, 2011·1 cites·20 claims
- 0542US8662309B2Method for packing tab tape, and packing structure for tab tapeKUDOSE SATORU·Filed 2009·Granted Mar 4, 2014·0 cites·24 claims
- 0642US8390104B2Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structureKUDOSE SATORU·Filed 2008·Granted Mar 5, 2013·0 cites·9 claims
- 0740US2007290302A1IC chip package, and image display apparatus using sameSHARP KK·Filed 2007·Application pending·0 cites
- 0840US2009302464A1Semiconductor deviceNAKAGAWA TOMOKATSU·Filed 2007·Application pending·0 cites
- 0939US2010044871A1Semiconductor device, display device, and electronic deviceKATOH TATSUYA·Filed 2007·Application pending·0 cites
- 1039US2010252671A1Conductive reelKUDOSE SATORU·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →