Inventor · disambiguated record
Satoru Kurita
Also filed as: KURITA SATORU
13 granted patents·10 pending applications·59 citations·filing 1999–2019
85Inventor score
Files withDOWA ELECTRONICS MATERIALS CO LTD11DOWA METALTECH CO LTD3KURITA SATORU2ABI LTD1DOWA ELECTRONICS MATERLS CO LTD1
Top patents by PatentIndex Score
23 records- 0181US6250087B1Super-quick freezing method and apparatus thereforABI LTD·Filed 1999·Granted Jun 26, 2001·52 cites·13 claims
- 0273US10328534B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Granted Jun 25, 2019·2 cites·15 claims
- 0369US9662748B2Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding methodDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Granted May 30, 2017·1 cites·8 claims
- 0467US10510557B2Electronic part mounting substrate and method for producing sameDOWA METALTECH CO LTD·Filed 2013·Granted Dec 17, 2019·0 cites·13 claims
- 0567US9831157B2Method of attaching an electronic part to a copper plate having a surface roughnessDOWA METALTECH CO LTD·Filed 2014·Granted Nov 28, 2017·2 cites·7 claims
- 0666US9533380B2Bonding material and bonding method in which said bonding material is usedENDOH KEIICHI·Filed 2012·Granted Jan 3, 2017·2 cites·8 claims
- 0763US2018331063A1Method for joining electronic part using a joining silver sheetDOWA ELECTRONICS MATERIALS CO LTD·Filed 2018·Application pending·0 cites
- 0861US2016254243A1Joining silver sheet, method for manufacturing same, and method for joining electronic partDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Application pending·0 cites
- 0955US10543569B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Jan 28, 2020·0 cites·20 claims
- 1054US2020083062A1Electronic part mounting substrate and method for producing sameDOWA METALTECH CO LTD·Filed 2019·Application pending·0 cites
- 1148US12048964B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Granted Jul 30, 2024·0 cites·17 claims
- 1245US2020094318A1Bonding material and bonding method employing sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Application pending·0 cites
- 1345US2010112361A1Method of removing lead, reclaimed metals and reclaimed productsTAMURA KAKEN CORP·Filed 2009·Application pending·0 cites
- 1444US11453053B2Joining material and joining method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Granted Sep 27, 2022·0 cites·20 claims
- 1541US2019382607A1Method for producing silver nanowire ink, silver nanowire ink, and transparent conductive coated filmDOWA ELECTRONICS MATERLS CO LTD·Filed 2018·Application pending·0 cites
- 1641US2016121435A1Metal paste for joining, joining method and joined bodyFURUKAWA MASASHI·Filed 2014·Application pending·0 cites
- 1740US10821558B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Nov 3, 2020·0 cites·7 claims
- 1837US9273235B2Bonding material comprising coated silver nanoparticles and bonded object produced using sameKURITA SATORU·Filed 2011·Granted Mar 1, 2016·0 cites·10 claims
- 1937US2020035637A1Bonding material and bonded product using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2018·Application pending·0 cites
- 2036US2014120359A2Low-temperature sinterable metal nanoparticle composition and electronic article formed using the compositionJABLONSKI GREGORY A·Filed 2011·Application pending·0 cites
- 2135US2013265735A1Metal nanoparticle paste, electronic component assembly using metal nanoparticle paste, led module, and method for forming circuit for printed wiring boardNAKATANI ISAO·Filed 2011·Application pending·0 cites
- 2233US10903185B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Jan 26, 2021·0 cites·13 claims
- 2333US9486879B2Bonding material and bonding body, and bonding methodKURITA SATORU·Filed 2011·Granted Nov 8, 2016·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →