Electronic part mounting substrate and method for producing same

Abstract

An electronic part mounting substrate includes: a metal plate 10 (for mounting thereon electronic parts) of aluminum or an aluminum alloy having a substantially rectangular planar shape, one major surface of the metal plate 10 being surface-processed so as to have a surface roughness of not less than 0.2 micrometers; a plating film 20 of nickel or a nickel alloy formed on the one major surface of the metal plate 10; an electronic part 14 bonded to the plating film 20 by a silver bonding layer 12 (containing a sintered body of silver); a ceramic substrate having a substantially rectangular planar shape, one major surface of the ceramic substrate 16 being bonded to the other major surface of the metal plate 10; and a radiating metal plate (metal base plate) 18 bonded to the other major surface of the ceramic substrate 16.

1 - 9 . (canceled) 
     
     
         10 . An electronic part mounting substrate comprising:
 a metal plate of aluminum or an aluminum alloy, the metal plate having a Vickers hardness Hv of 23.2 to 38, one side of the metal plate having a surface roughness of 0.3 to 2.0 micrometers;   a silver bonding layer formed on the one side of the metal plate; and   an electronic part bonded to the one side of the metal plate with the silver bonding layer.   
     
     
         11 . An electronic part mounting substrate comprising:
 a metal plate of aluminum or an aluminum alloy, one side of the metal plate having a surface roughness of 0.3 to 2.0 micrometers;   a plating film of nickel or a nickel alloy formed on the one side of the metal plate, the plating film having a surface roughness of 0.5 to 2.0 micrometers;   a silver bonding layer formed on the plating film; and   an electronic part bonded to the plating film with the silver bonding layer.   
     
     
         12 . (canceled) 
     
     
         13 . An electronic part mounting substrate as set forth in  claim 10 , wherein a surface of said electronic part to be bonded to said one side of the metal plate is covered with a metal capable of being bonded with said silver bonding layer. 
     
     
         14 . An electronic part mounting substrate as set forth in  claim 13 , wherein said metal capable of being bonded with said silver bonding layer is at least one metal, which is selected from the group consisting of gold, silver, copper and palladium, or an alloy thereof. 
     
     
         15 . An electronic part mounting substrate as set forth in  claim 10 , wherein a surface of said electronic part to be bonded to said one side of the metal plate is plated with at least one metal, which is selected from the group consisting of gold, silver and palladium, or an alloy thereof. 
     
     
         16 . An electronic part mounting substrate as set forth in  claim 10 , wherein said silver bonding layer contains a sintered body of silver. 
     
     
         17 . An electronic part mounting substrate as set forth in  claim 10 , wherein one side of a ceramic substrate is bonded to the other side of said metal plate. 
     
     
         18 . An electronic part mounting substrate as set forth in  claim 17 , wherein a metal base plate is bonded to the other side of said ceramic substrate. 
     
     
         19 - 25 . (canceled) 
     
     
         26 . An electronic part mounting substrate as set forth in  claim 11 , wherein a surface of said electronic part to be bonded to said plating film is covered with a metal capable of being bonded with said silver bonding layer. 
     
     
         27 . An electronic part mounting substrate as set forth in  claim 26 , wherein said metal capable of being bonded with said silver bonding layer is at least one metal, which is selected from the group consisting of gold, silver, copper and palladium, or an alloy thereof. 
     
     
         28 . An electronic part mounting substrate as set forth in  claim 11 , wherein a surface of said electronic part to be bonded to said plating film is plated with at least one metal, which is selected from the group consisting of gold, silver and palladium, or an alloy thereof. 
     
     
         29 . An electronic part mounting substrate as set forth in  claim 11 , wherein said silver bonding layer contains a sintered body of silver. 
     
     
         30 . An electronic part mounting substrate as set forth in  claim 11 , wherein one side of a ceramic substrate is bonded to the other side of said metal plate. 
     
     
         31 . An electronic part mounting substrate as set forth in  claim 30 , wherein a metal base plate is bonded to the other side of said ceramic substrate.