Inventor · disambiguated record
Hideyo Osanai
Also filed as: OSANAI HIDEYO
35 granted patents·4 pending applications·206 citations·filing 2001–2021
97Inventor score
Top patents by PatentIndex Score
39 records- 0186US6912130B2Combined member of aluminum-ceramicsDOWA MINING CO·Filed 2003·Granted Jun 28, 2005·46 cites·16 claims
- 0283US10619948B2Heat radiating plate with supporting members and protrusion membersDOWA METALTECH CO LTD·Filed 2013·Granted Apr 14, 2020·4 cites·8 claims
- 0381US7348493B2Metal-ceramic circuit boardDOWA MINING CO·Filed 2001·Granted Mar 25, 2008·27 cites·17 claims
- 0480US8927873B2Fin-integrated substrate and manufacturing method of fin-integrated substrateHORI HISASHI·Filed 2011·Granted Jan 6, 2015·6 cites·23 claims
- 0579US8745841B2Aluminum bonding member and method for producing sameOSANAI HIDEYO·Filed 2012·Granted Jun 10, 2014·5 cites·5 claims
- 0678US9944565B2Metal/ceramic bonding substrate and method for producing sameDOWA METALTECH CO LTD·Filed 2012·Granted Apr 17, 2018·6 cites·16 claims
- 0776US7256353B2Metal/ceramic bonding substrate and method for producing sameDOWA MINING CO·Filed 2003·Granted Aug 14, 2007·23 cites·10 claims
- 0875US9474146B2Manufacturing method of radiator-integrated substrate and radiator-integrated substrateNIPPON LIGHT METAL CO·Filed 2013·Granted Oct 18, 2016·5 cites·10 claims
- 0974US6938333B2Method of manufacturing a metal-ceramic circuit boardDOWA MINING CO·Filed 2002·Granted Sep 6, 2005·16 cites·11 claims
- 1069US7131483B2Apparatus, mold, and method for manufacturing metal-ceramic composite memberDOWA MINING CO·Filed 2003·Granted Nov 7, 2006·9 cites·3 claims
- 1167US10510557B2Electronic part mounting substrate and method for producing sameDOWA METALTECH CO LTD·Filed 2013·Granted Dec 17, 2019·0 cites·13 claims
- 1267US9831157B2Method of attaching an electronic part to a copper plate having a surface roughnessDOWA METALTECH CO LTD·Filed 2014·Granted Nov 28, 2017·2 cites·7 claims
- 1367US8011416B2Apparatus, mold, and method for manufacturing metal-ceramic composite memberDOWA METALTECH CO LTD·Filed 2006·Granted Sep 6, 2011·3 cites·6 claims
- 1467US7368665B2Circuit board and a power module employing the sameDOWA MINING CO·Filed 2005·Granted May 6, 2008·2 cites·19 claims
- 1565US7255931B2Aluminum/ceramic bonding substrate and method for producing sameDOWA MINING CO·Filed 2004·Granted Aug 14, 2007·12 cites·6 claims
- 1663US7487585B2Method of manufacturing a metal-ceramic circuit boardDOWA METALTECH CO LTD·Filed 2006·Granted Feb 10, 2009·2 cites·7 claims
- 1763US7304378B2Aluminum/ceramic bonding substrateDOWA MINING CO·Filed 2005·Granted Dec 4, 2007·2 cites·12 claims
- 1862US7393596B2Aluminum/ceramic bonding substrate and method for producing sameDOWA MINING CO·Filed 2006·Granted Jul 1, 2008·2 cites·5 claims
- 1959US7073703B2Aluminum/ceramic bonding substrate and method for producing sameDOWA MINING CO·Filed 2003·Granted Jul 11, 2006·8 cites·4 claims
- 2058US11919288B2Method for producing heat radiation memberDOWA METALTECH CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·2 claims
- 2158US7189449B2Metal/ceramic bonding substrate and method for producing sameDOWA MINING CO·Filed 2004·Granted Mar 13, 2007·6 cites·18 claims
- 2258US7122243B2Metal/ceramic bonding substrate and method for producing sameDOWA MINING CO·Filed 2004·Granted Oct 17, 2006·7 cites·14 claims
- 2357US7159310B2Electronic part mounting substrate and method for producing sameDOWA MINING CO·Filed 2004·Granted Jan 9, 2007·6 cites·8 claims
- 2456US12300512B2Metal/ceramic bonding substrate and method for producing sameDOWA METALTECH CO LTD·Filed 2020·Granted May 13, 2025·0 cites·6 claims
- 2555US9320129B2Liquid-cooled integrated substrate and manufacturing method of liquid-cooled integrated substrateHORI HISASHI·Filed 2011·Granted Apr 19, 2016·1 cites·8 claims
- 2654US2020083062A1Electronic part mounting substrate and method for producing sameDOWA METALTECH CO LTD·Filed 2019·Application pending·0 cites
- 2753US12145352B2Metal/ceramic bonding substrate and method for producing sameDOWA METALTECH CO LTD·Filed 2020·Granted Nov 19, 2024·0 cites·7 claims
- 2853US11162745B2Heat radiating plate and method for producing sameDOWA METALTECH CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·11 claims
- 2952US12221389B2Aluminum/ceramic bonding substrate and method for producing sameDOWA METALTECH CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·9 claims
- 3051US8039757B2Electronic part mounting substrate and method for producing sameDOWA METALTECH CO LTD·Filed 2006·Granted Oct 18, 2011·0 cites·17 claims
- 3150US7008549B2Circuit board, process for producing the same and a power module employing the sameDOWA MINING CO·Filed 2004·Granted Mar 7, 2006·2 cites·16 claims
- 3249US2008230515A1Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereofDOWA MINING CO·Filed 2008·Application pending·0 cites
- 3346US7387741B2Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereofDOWA MINING CO·Filed 2003·Granted Jun 17, 2008·2 cites·16 claims
- 3446US2005217823A1Aluminum bonding member and method for producing sameDOWA MINING CO·Filed 2005·Application pending·0 cites
- 3546US2005138799A1Method of manufacturing a metal-ceramic circuit boardDOWA MINING CO·Filed 2005·Application pending·0 cites
- 3645US7340828B2Method for producing metal/ceramic bonding circuit boardDOWA MINING CO·Filed 2004·Granted Mar 11, 2008·1 cites·5 claims
- 3742US7276292B2Insulating substrate boards for semiconductor and power modulesDOWA MINING CO·Filed 2002·Granted Oct 2, 2007·1 cites·38 claims
- 3841US6997233B2Mold and method for manufacturing metal-ceramic composite memberDOWA MINING CO·Filed 2003·Granted Feb 14, 2006·0 cites·12 claims
- 3937US9713253B2Metal/ceramic bonding substrate and method for producing sameOSANAI HIDEYO·Filed 2011·Granted Jul 18, 2017·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →