Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof

Abstract

The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate is bonded on a part of a ceramic substrate so as to expose an outer peripheral edge portion of the ceramic substrate in an integrally bonded member, the integrally bonded member is set on a treating apparatus while being covered with a masking member having a window portion from which the circuit pattern forming metal plate of the integrally bonded member is exposed. Further, the integrally bonded member is pressed with an appropriate pressure from a base plate side so that a boundary surface between a portion surrounding the window portion in the masking member and an exposed surface of the ceramic substrate which is exposed in a metal-ceramic bonded member has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution for wet treatment is injected from an injection pipe to be in contact with the circuit pattern forming metal plate.

1 . A wet treatment method of a metal-ceramic bonded member of a base integral type which is so structured that a metal-ceramic bonded member is bonded on a base member, the metal-ceramic bonded member being constituted of a ceramic substrate and a circuit pattern forming metal plate bonded on the ceramic substrate, the method comprising:
 having a masking member cover said metal-ceramic bonded member of the base integral type in which said base member is bonded on said ceramic substrate so as to be exposed in a portion surrounding said ceramic substrate, said masking member having a window portion from which said ceramic substrate is exposed;   pressing said masking member against said exposed base member so as to prevent a treatment solution for said wet treatment from passing through a portion where said masking member and the base member exposed in the portion surrounding said ceramic substrate are in contact with each other; and   during pressing said masking member, bringing the treatment solution for the wet treatment of said circuit pattern forming metal plate into contact with said circuit pattern forming metal plate.   
   
   
       2 . A wet treatment method of a metal-ceramic bonded member of a base integral type according to  claim 1 , wherein said base member has a plate shape or a fin structure. 
   
   
       3 . A wet treatment method of a metal-ceramic bonded member and a metal-ceramic bonded member of a base integral type according to  claim 2 ,
 wherein said treatment solution is an etching solution for said circuit pattern forming metal plate, and   wherein the circuit pattern forming metal plate of said metal-ceramic bonded member is covered with the masking member having the window portion from which said circuit pattern forming metal plate is exposed, after a projection patter having a resistance to said etching solution is formed on a desired portion.   
   
   
       4 . A wet treatment method of a metal-ceramic bonded member and a metal-ceramic bonded member of a base integral type according to  claim 2 ,
 wherein said treatment solution is a plating solution for said circuit pattern forming metal plate.   
   
   
       5 . A wet treatment method of a metal-ceramic bonded member and a metal-ceramic bonded member of a base integral type according to  claim 2 ,
 wherein said treatment solution is a plating solution for said circuit pattern forming metal plate, and   wherein the circuit pattern forming metal plate of said metal-ceramic bonded member is covered with the masking member having the window portion from which said circuit pattern forming metal plate is exposed, after a protection pattern preventing plating with said plating solution is formed on a desired portion.   
   
   
       6 . A wet treatment method of a metal-ceramic bonded member and a metal-ceramic bonded member of a base integral type according to  claim 3 ,
 wherein an appropriate resist is applied to or an appropriate film is laminated on said circuit pattern forming metal plate to form said protection pattern.   
   
   
       7 . A masking member which is used for a wet treatment method of a metal-ceramic bonded member of a base integral type which is so structured that a metal-ceramic bonded member is bonded on a base member, the metal-ceramic bonded member being constituted of a ceramic substrate and a circuit pattern forming metal plate bonded on the ceramic substrate, and which has a window portion from which said circuit pattern forming metal plate is exposed,
 wherein a portion surrounding said window portion is pressed against said ceramic substrate or said base member.   
   
   
       8 . A masking member according to  claim 7 , further comprising:
 a base having said window portion; a pressing portion having said window portion and deformable by a pressing force; and a plurality of elastic members,   wherein said pressing portion is disposed on said base via said plural elastic members,   wherein said metal-ceramic bonded member of the base integral type is disposed on said pressing portion, and   wherein said metal-ceramic bonded member of the base integral type is pressed against said pressing portion.   
   
   
       9 . A wet treatment equipment having a tank which feeds a treatment solution to a metal plate bonded on a substrate to perform wet treatment of the metal plate, the wet treatment equipment comprising:
 a treatment solution feeding portion, which is provided in said tank, to feed the treatment solution to said metal plate;   a substrate setting portion, which is provided on an upper surface or a side surface of said tank, to set said substrate thereon; and   an opening portion of said tank to expose to an inner part of said tank the metal plate bonded on the substrate which is set on said substrate setting portion.   
   
   
       10 . A wet treatment equipment according to  claim 9 ,
 wherein the opening portion of said tank is provided with a guide member to movably set said substrate on said opening portion.   
   
   
       11 . A wet treatment equipment according to  claim 9 , wherein said substrate with said masking member attached thereto is subjected to the wet treatment. 
   
   
       12 . A power module member, being manufactured from the metal-ceramic bonded member or the metal-ceramic bonded member of the base integral type by the wet treatment method according to  claim 2 . 
   
   
       13 . A power module, being manufactured from the power module member according to  claim 12 .