Inventor · disambiguated record
Sangick Lee
Also filed as: LEE SANGICK
2 granted patents·8 pending applications·0 citations·filing 2006–2024
26Inventor score
Files withDNF CO LTD4SAMSUNG ELECTRONICS CO LTD2SK INNOVATION CO LTD2CHO YUN J1SAMSUNG CORNING CO LTD1
Top patents by PatentIndex Score
10 records- 0178US12365781B2Method for removing chlorine from pyrolysis process of waste plasticSK INNOVATION CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·15 claims
- 0266US2024294725A1Method for Removing Chlorine From Pyrolysis Process of Waste PlasticSK INNOVATION CO LTD·Filed 2022·Application pending·0 cites
- 0362US2025179627A1Composition for depositing a molybdenum-containing thin film, method for manufacturing a molybdenum-containing thin film, and molybdenum-containing thin film manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0459US2025157809A1Thin-film forming composition including aluminum compound, method of forming thin film by using the thin-film forming composition, and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0557US12459959B2Indium compound, method of producing the same, composition for depositing indium-containing thin film, and indium-containing thin filmDNF CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·12 claims
- 0652US2025250462A1Silicon-bearing encapsulation film composition including silazane compound and method for manufacturing silicon-bearing encapsulation film using sameDNF CO LTD·Filed 2023·Application pending·0 cites
- 0746US2025215559A1Indium compound, indium-containing thin film deposition composition comprising same, and indium-containing thin film manufacturing methodDNF CO LTD·Filed 2023·Application pending·0 cites
- 0846US2025199396A1Method for manufacturing pellicle for forming metal silicide capping layer and pellicle manufactured therefromDNF CO LTD·Filed 2023·Application pending·0 cites
- 0941US2009229189A1Method for preparing a polishing slurry having high dispersion stabilitySAMSUNG CORNING CO LTD·Filed 2009·Application pending·0 cites
- 1035US2006213126A1Method for preparing a polishing slurry having high dispersion stabilityCHO YUN J·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →