Inventor · disambiguated record
Sang-Woo Pae
Also filed as: PAE SANG-WOO
16 granted patents·2 pending applications·26 citations·filing 2015–2022
89Inventor score
Top patents by PatentIndex Score
18 records- 0188US10191099B2Semiconductor test device and method, and data analysis deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 29, 2019·4 cites·12 claims
- 0283US9892977B2FinFET and method of forming fin of the FinFETSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 13, 2018·4 cites·18 claims
- 0381US11488877B2Semiconductor device including test structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 1, 2022·3 cites·19 claims
- 0480US10262998B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 16, 2019·4 cites·9 claims
- 0580US10186516B2One time programmable memory device, method of manufacturing the same, and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 22, 2019·5 cites·11 claims
- 0676US11245018B2Semiconductor device including a gate structure with a wider end portion than a linear portionSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·2 cites·20 claims
- 0772US10157259B2Method and device for predicting reliability failure rate of semiconductor integrated circuit and method of manufacturing the semiconductor integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
- 0865US10298214B2Clock switch device and system-on-chip having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 21, 2019·1 cites·20 claims
- 0954US10276571B2Circuit design system and semiconductor circuit designed by using the systemSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 1052US9728486B2Semiconductor device including a fin patternPAE SANG-WOO·Filed 2015·Granted Aug 8, 2017·1 cites·12 claims
- 1147US2016225769A1Circuit design system and semiconductor circuit designed by using the systemLEE KYONG-TAEK·Filed 2016·Application pending·0 cites
- 1243US10943900B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 9, 2021·0 cites·17 claims
- 1342US12406912B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·16 claims
- 1441US11563002B2Semiconductor devices having gate electrodes and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 24, 2023·0 cites·20 claims
- 1541US10347576B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 9, 2019·0 cites·20 claims
- 1636US10014267B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 3, 2018·0 cites·15 claims
- 1734US10490477B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 26, 2019·0 cites·14 claims
- 1829US2017069615A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →