Inventor · disambiguated record
Sangjine Park
Also filed as: PARK SANGJINE · PARK SANGJINE PARK
29 granted patents·37 pending applications·48 citations·filing 2011–2025
94Inventor score
Top patents by PatentIndex Score
66 records- 0187US9859432B2Semiconductor devices having spacer protection patternSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 2, 2018·6 cites·20 claims
- 0286US12287147B2Wafer processing equipment and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 29, 2025·1 cites·10 claims
- 0386US9117692B2Semiconductor device having dual metal silicide layers and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 25, 2015·7 cites·12 claims
- 0485US9960241B2Semiconductor device for manufacturingSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 1, 2018·5 cites·20 claims
- 0583US8841769B2Semiconductor device having metal plug and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 23, 2014·7 cites·20 claims
- 0682US9748234B2Semiconductor devices and methods of fabricating the sameKWON KEE SANG·Filed 2015·Granted Aug 29, 2017·6 cites·18 claims
- 0781US9716162B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 25, 2017·3 cites·20 claims
- 0881US2025387810A1Substrate processing apparatus and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0980US12278133B2Substrate transferring unit, substrate processing apparatus, and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·4 claims
- 1079US10128336B2Semiconductor devices and methods for manufacturing the samePARK SANGJINE·Filed 2016·Granted Nov 13, 2018·3 cites·22 claims
- 1179US9966432B2Semiconductor devices including an etch stop pattern and a sacrificial pattern with coplanar upper surfaces and a gate and a gap fill pattern with coplanar upper surfacesPARK SANGJINE·Filed 2016·Granted May 8, 2018·3 cites·28 claims
- 1278US12422754B2Substrate processing apparatus, semiconductor manufacturing equipment, and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·19 claims
- 1375US11217748B2Semiconductor device including a data storage material patternSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·1 cites·19 claims
- 1474US12420316B2Substrate processing apparatus and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 1573US2025210405A1Substrate transferring unit, substrate processing apparatus, and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1673US2024339334A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1771US11881426B2Substrate transferring unit, substrate processing apparatus, and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 23, 2024·0 cites·10 claims
- 1871US11527399B2Wafer cleaning apparatus based on light irradiation and wafer cleaning system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 13, 2022·1 cites·20 claims
- 1971US2025259862A1Apparatus and method for drying substrateSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2070US10714472B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 14, 2020·1 cites·18 claims
- 2170US2025224177A1Wafer processing equipment and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2269US12308255B2Apparatus and method for drying substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 2369US12057323B2Substrate processing method, micropattern forming method, and substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·17 claims
- 2469US11640115B2Substrate processing apparatus, semiconductor manufacturing equipment, and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 2, 2023·0 cites·20 claims
- 2569US8735239B2Semiconductor devices including compressive stress patterns and methods of fabricating the samePARK SANGJINE·Filed 2011·Granted May 27, 2014·3 cites·13 claims
- 2669US2025235980A1Substrate lapping apparatus and substrate lapping method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2766US12463061B2Wafer drying apparatus, wafer processing system including the same, and wafer processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·7 claims
- 2865US2025155816A1Apparatus for drying wafer and method for drying waferSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2964US12216408B2Apparatus for drying wafer and method for drying waferSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·11 claims
- 3063US11424202B2Semiconductor devices having landing padsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 23, 2022·1 cites·20 claims
- 3162US2025214114A1Substrate cleaning head, substrate cleaning module including the same, substrate cleaning system including the same, and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3262US2025332620A1Cleaning apparatus and substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3362US2025157896A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3462US2025372387A1Substrate processing apparatus and substate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3561US2024036476A1Substrate processing apparatus and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3661US2025038110A1Integrated circuit devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3761US2025380498A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3861US2025167141A1Semiconductor device and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3961US2025234625A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4061US2025169108A1Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4161US2025192040A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4260US12198923B2Substrate processing method and substrate processing systemSEMES CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·19 claims
- 4360US2025287688A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4459US2025014915A1Substrate processing system and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4559US2025185293A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4658US2024280906A1Substrate processing baffle, substrate processing apparatus including the same, and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4758US2024192071A1Baffle inspection apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4858US2024178024A1Substrate processing apparatus and substrate processing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4957US2024173751A1Substrate cleaning chamber, a substrate processing system including the same, and a method of processing a substrate using the substrate processing systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 5057US2025194215A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →