Inventor · disambiguated record
Saravanan Sethuraman
Also filed as: SETHURAMAN SARAVANAN
101 granted patents·16 pending applications·255 citations·filing 2006–2024
99Inventor score
Top patents by PatentIndex Score
117 records- 0198US9529543B1Concurrent upgrade and backup of non-volatile memoryIBM·Filed 2016·Granted Dec 27, 2016·41 cites·1 claims
- 0295US10379784B1Write management for increasing non-volatile memory reliabilityIBM·Filed 2018·Granted Aug 13, 2019·18 cites·20 claims
- 0393US9858208B2System for securing contents of removable memoryIBM·Filed 2013·Granted Jan 2, 2018·20 cites·20 claims
- 0491US9996411B1In-channel memory mirroringIBM·Filed 2016·Granted Jun 12, 2018·7 cites·17 claims
- 0591US9263157B2Detecting defective connections in stacked memory devicesIBM·Filed 2013·Granted Feb 16, 2016·11 cites·16 claims
- 0689US9734885B1Thermal-aware memoryIBM·Filed 2016·Granted Aug 15, 2017·9 cites·20 claims
- 0789US8869007B2Three dimensional (3D) memory device sparingCORDERO EDGAR R·Filed 2012·Granted Oct 21, 2014·12 cites·20 claims
- 0888US9875036B2Concurrent upgrade and backup of non-volatile memoryIBM·Filed 2017·Granted Jan 23, 2018·6 cites·1 claims
- 0988US9761294B1Thermal-aware memoryIBM·Filed 2016·Granted Sep 12, 2017·9 cites·20 claims
- 1088US9405468B2Stacked memory device controlGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 2, 2016·10 cites·20 claims
- 1185US10075440B1Multi-party secure global attestationIBM·Filed 2017·Granted Sep 11, 2018·5 cites·20 claims
- 1285US9607716B2Detecting defective connections in stacked memory devicesIBM·Filed 2014·Granted Mar 28, 2017·6 cites·4 claims
- 1383US10394618B2Thermal and power memory actionsIBM·Filed 2017·Granted Aug 27, 2019·3 cites·17 claims
- 1483US8996953B2Self monitoring and self repairing ECCIBM·Filed 2013·Granted Mar 31, 2015·6 cites·20 claims
- 1583US8552291B2Cable for high speed data communicationsLINGAMBUDI ANIL B·Filed 2010·Granted Oct 8, 2013·11 cites·12 claims
- 1681US10446255B2Reference voltage calibration in memory during runtimeIBM·Filed 2016·Granted Oct 15, 2019·6 cites·13 claims
- 1781US10025508B2Concurrent upgrade and backup of non-volatile memoryIBM·Filed 2015·Granted Jul 17, 2018·2 cites·5 claims
- 1880US10223004B2Parallel read and writes in 3D flash memoryIBM·Filed 2016·Granted Mar 5, 2019·3 cites·17 claims
- 1980US9230687B2Implementing ECC redundancy using reconfigurable logic blocksIBM·Filed 2013·Granted Jan 5, 2016·7 cites·18 claims
- 2079US9904611B1Data buffer spare architectures for dual channel serial interface memoriesIBM·Filed 2016·Granted Feb 27, 2018·2 cites·20 claims
- 2179US8853847B2Stacked chip module with integrated circuit chips having integratable and reconfigurable built-in self-maintenance blocksIBM·Filed 2012·Granted Oct 7, 2014·5 cites·25 claims
- 2277US11164847B2Methods and apparatus for managing thermal behavior in multichip packagesINTEL CORP·Filed 2019·Granted Nov 2, 2021·2 cites·20 claims
- 2377US8874979B2Three dimensional(3D) memory device sparingCORDERO EDGAR R·Filed 2012·Granted Oct 28, 2014·6 cites·20 claims
- 2475US9389972B2Data retrieval from stacked computer memoryIBM·Filed 2014·Granted Jul 12, 2016·3 cites·11 claims
- 2574US10069829B1Multi-party secure global attestationIBM·Filed 2017·Granted Sep 4, 2018·2 cites·1 claims
- 2673US11037619B2Using dual channel memory as single channel memory with sparesIBM·Filed 2019·Granted Jun 15, 2021·2 cites·18 claims
- 2773US10353455B2Power management in multi-channel 3D stacked DRAMIBM·Filed 2017·Granted Jul 16, 2019·1 cites·16 claims
- 2873US10042726B2Data buffer spare architectures for dual channel serial interface memoriesIBM·Filed 2017·Granted Aug 7, 2018·1 cites·1 claims
- 2972US9665115B2Reconfigurable power distribution system for three-dimensional integrated circuitsIBM·Filed 2016·Granted May 30, 2017·2 cites·9 claims
- 3072US9378104B2Mirroring in three-dimensional stacked memoryIBM·Filed 2014·Granted Jun 28, 2016·2 cites·12 claims
- 3171US10198300B1Thermal and power memory actionsIBM·Filed 2017·Granted Feb 5, 2019·1 cites·1 claims
- 3270US9542110B2Performance optimization of read functions in a memory systemIBM·Filed 2015·Granted Jan 10, 2017·1 cites·6 claims
- 3370US9251054B2Implementing enhanced reliability of systems utilizing dual port DRAMIBM·Filed 2014·Granted Feb 2, 2016·2 cites·13 claims
- 3470US9147499B2Memory operation of paired memory devicesIBM·Filed 2013·Granted Sep 29, 2015·2 cites·6 claims
- 3569US8676559B2System and method for providing efficient schematic reviewSETHURAMAN SARAVANAN·Filed 2009·Granted Mar 18, 2014·9 cites·15 claims
- 3669US7921404B2Method of reusing constraints in PCB designsIBM·Filed 2007·Granted Apr 5, 2011·6 cites·5 claims
- 3768US10740177B2Optimizing error correcting code in three-dimensional stacked memoryIBM·Filed 2018·Granted Aug 11, 2020·2 cites·20 claims
- 3867US11658159B2Methods and apparatus for managing thermal behavior in multichip packagesINTEL CORP·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 3966US9361195B2Mirroring in three-dimensional stacked memoryIBM·Filed 2014·Granted Jun 7, 2016·1 cites·8 claims
- 4066US8902750B2Translating between an ethernet protocol and a converged enhanced ethernet protocolBASSO CLAUDE·Filed 2011·Granted Dec 2, 2014·2 cites·24 claims
- 4166US8872322B2Stacked chip module with integrated circuit chips having integratable built-in self-maintenance blocksINTERNAT BUSINESSS MACHINES CORP·Filed 2012·Granted Oct 28, 2014·2 cites·25 claims
- 4264US10949122B2Write management for increasing non-volatile memory reliabilityIBM·Filed 2019·Granted Mar 16, 2021·1 cites·20 claims
- 4364US9886200B2Concurrent upgrade and backup of non-volatile memoryIBM·Filed 2017·Granted Feb 6, 2018·1 cites·1 claims
- 4463US10209896B2Performance optimization of read functions in a memory systemIBM·Filed 2016·Granted Feb 19, 2019·1 cites·10 claims
- 4562US10642504B2Thermal and power memory actionsIBM·Filed 2019·Granted May 5, 2020·0 cites·18 claims
- 4662US10546628B2Using dual channel memory as single channel memory with sparesIBM·Filed 2018·Granted Jan 28, 2020·1 cites·16 claims
- 4761US2025117343A1Passing sensing information in a memory stack through a proxy dieINTEL CORP·Filed 2024·Application pending·0 cites
- 4860US9298201B2Power delivery to three-dimensional chipsIBM·Filed 2013·Granted Mar 29, 2016·1 cites·6 claims
- 4959US11955431B2Interposer structures and methods for 2.5D and 3D packagingINTEL CORP·Filed 2020·Granted Apr 9, 2024·0 cites·18 claims
- 5059US10452470B2In-channel memory mirroringIBM·Filed 2018·Granted Oct 22, 2019·0 cites·18 claims
Showing the top 50 of 117 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →