Inventor · disambiguated record
Satoshi Shimamoto
Also filed as: SHIMAMOTO SATOSHI
49 granted patents·4 pending applications·500 citations·filing 1993–2020
98Inventor score
Files withHITACHI INT ELECTRIC INC43KOBE STEEL LTD3KOKUSAI ELECTRIC CORP3RENESAS TECH CORP2HITACHI LTD1
Top patents by PatentIndex Score
53 records- 0198US9929005B1Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 27, 2018·345 cites·7 claims
- 0292US9613798B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Apr 4, 2017·8 cites·13 claims
- 0392US9054046B2Method of manufacturing semiconductor device and method of processing substrateHITACHI INT ELECTRIC INC·Filed 2012·Granted Jun 9, 2015·10 cites·20 claims
- 0491US9472391B2Semiconductor device manufacturing methodHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 18, 2016·11 cites·17 claims
- 0590US9349586B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted May 24, 2016·8 cites·18 claims
- 0688US9460911B2Method of manufacturing semiconductor device and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 4, 2016·4 cites·10 claims
- 0787US10490400B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Nov 26, 2019·4 cites·18 claims
- 0887US9218959B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Dec 22, 2015·6 cites·14 claims
- 0985US8785333B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Jul 22, 2014·6 cites·17 claims
- 1083US9698007B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 4, 2017·3 cites·16 claims
- 1183US8987146B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Mar 24, 2015·6 cites·19 claims
- 1282US10720325B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Jul 21, 2020·3 cites·15 claims
- 1382US9890458B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Feb 13, 2018·3 cites·19 claims
- 1482US9793107B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 17, 2017·4 cites·16 claims
- 1580US9773661B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Sep 26, 2017·3 cites·17 claims
- 1678US10607833B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Mar 31, 2020·2 cites·15 claims
- 1778US9524867B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Dec 20, 2016·2 cites·15 claims
- 1876US9478413B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2012·Granted Oct 25, 2016·3 cites·6 claims
- 1976US6635937B2Semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Oct 21, 2003·14 cites·23 claims
- 2072US9837261B2Method of manufacturing semiconductor device and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2016·Granted Dec 5, 2017·1 cites·12 claims
- 2172US9732426B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Aug 15, 2017·2 cites·16 claims
- 2271US10604842B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 31, 2020·1 cites·15 claims
- 2371US9991179B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 5, 2018·1 cites·17 claims
- 2471US9865458B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jan 9, 2018·1 cites·12 claims
- 2569US9831082B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 28, 2017·1 cites·16 claims
- 2669US9460916B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 4, 2016·1 cites·20 claims
- 2767US9673043B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 6, 2017·1 cites·13 claims
- 2866US9431240B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Granted Aug 30, 2016·1 cites·11 claims
- 2965US9978587B2Method of manufacturing semiconductor device including forming a film containing a first element, a second element and carbon, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted May 22, 2018·1 cites·14 claims
- 3064US9741556B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 22, 2017·1 cites·18 claims
- 3163US9899211B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Feb 20, 2018·1 cites·18 claims
- 3257US2019393057A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 3354US11094532B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 17, 2021·0 cites·15 claims
- 3454US5981301ARegeneration method and apparatus of wafer and substrateKOBE STEEL LTD·Filed 1997·Granted Nov 9, 1999·19 cites·9 claims
- 3553US6762444B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Jul 13, 2004·4 cites·10 claims
- 3651US2018277405A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2017·Application pending·0 cites
- 3749US10066298B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Sep 4, 2018·0 cites·16 claims
- 3848US10032629B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 24, 2018·0 cites·16 claims
- 3948US9685455B1Method of manufacturing semiconductor device having 3D structureHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 20, 2017·0 cites·15 claims
- 4047US10115583B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Oct 30, 2018·0 cites·19 claims
- 4146US10199219B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Feb 5, 2019·0 cites·13 claims
- 4246US7022563B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Apr 4, 2006·2 cites·22 claims
- 4345US10163910B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Dec 25, 2018·0 cites·13 claims
- 4445US5500170AHeating and extruding method and device for bulk preformKOBE STEEL LTD·Filed 1994·Granted Mar 19, 1996·10 cites·1 claims
- 4545US2016218012A1Method of forming fine pattern, method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 4644US10090322B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2017·Granted Oct 2, 2018·0 cites·8 claims
- 4742US10910214B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Feb 2, 2021·0 cites·14 claims
- 4842US10290492B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted May 14, 2019·0 cites·18 claims
- 4942US9355866B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted May 31, 2016·0 cites·18 claims
- 5039US5458838AHeating and extruding method for bulk preformKOBE STEEL LTD·Filed 1993·Granted Oct 17, 1995·7 cites·2 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →