Inventor · disambiguated record
Saravanapriyan Sriraman
Also filed as: SRIRAMAN SARAVANAPRIYAN
34 granted patents·10 pending applications·328 citations·filing 2006–2024
97Inventor score
Top patents by PatentIndex Score
44 records- 0197US10254641B2Layout pattern proximity correction through fast edge placement error predictionLAM RES CORP·Filed 2016·Granted Apr 9, 2019·32 cites·25 claims
- 0297US10197908B2Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling frameworkLAM RES CORP·Filed 2016·Granted Feb 5, 2019·27 cites·32 claims
- 0397US9053908B2Method and apparatus for controlling substrate DC-bias and ion energy and angular distribution during substrate etchingLAM RES CORP·Filed 2013·Granted Jun 9, 2015·56 cites·20 claims
- 0496US10572697B2Method of etch model calibration using optical scatterometryLAM RES CORP·Filed 2018·Granted Feb 25, 2020·9 cites·34 claims
- 0596US9996647B2Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimizationLAM RES CORP·Filed 2017·Granted Jun 12, 2018·12 cites·31 claims
- 0696US9792393B2Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimizationLAM RES CORP·Filed 2016·Granted Oct 17, 2017·19 cites·34 claims
- 0796US7303999B1Multi-step method for etching strain gate recessesLAM RES CORP·Filed 2006·Granted Dec 4, 2007·95 cites·24 claims
- 0895US10534257B2Layout pattern proximity correction through edge placement error predictionLAM RES CORP·Filed 2017·Granted Jan 14, 2020·17 cites·14 claims
- 0994US10585347B2Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling frameworkLAM RES CORP·Filed 2018·Granted Mar 10, 2020·9 cites·21 claims
- 1093US10303830B2Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimizationLAM RES CORP·Filed 2018·Granted May 28, 2019·9 cites·29 claims
- 1191US10410832B2Control of on-wafer CD uniformity with movable edge ring and gas injection adjustmentLAM RES CORP·Filed 2016·Granted Sep 10, 2019·8 cites·12 claims
- 1290US10997345B2Method of etch model calibration using optical scatterometryLAM RES CORP·Filed 2020·Granted May 4, 2021·3 cites·34 claims
- 1390US10386828B2Methods and apparatuses for etch profile matching by surface kinetic model optimizationLAM RES CORP·Filed 2015·Granted Aug 20, 2019·8 cites·33 claims
- 1488US10262867B2Fast-gas switching for etchingLAM RES CORP·Filed 2016·Granted Apr 16, 2019·4 cites·19 claims
- 1583US10163610B2Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operationLAM RES CORP·Filed 2016·Granted Dec 25, 2018·3 cites·21 claims
- 1683US9885493B2Air cooled faraday shield and methods for using the sameLAM RES CORP·Filed 2013·Granted Feb 6, 2018·4 cites·21 claims
- 1782US11704463B2Method of etch model calibration using optical scatterometryLAM RES CORP·Filed 2021·Granted Jul 18, 2023·1 cites·24 claims
- 1881US11887819B2Systems for cooling RF heated chamber componentsLAM RES CORP·Filed 2022·Granted Jan 30, 2024·0 cites·17 claims
- 1980US9978565B2Systems for cooling RF heated chamber componentsMCCHESNEY JON·Filed 2011·Granted May 22, 2018·4 cites·20 claims
- 2076US9966270B2Gas reaction trajectory control through tunable plasma dissociation for wafer by-product distribution and etch feature profile uniformityLAM RES CORP·Filed 2015·Granted May 8, 2018·2 cites·18 claims
- 2175US11624981B2Resist and etch modelingLAM RES CORP·Filed 2019·Granted Apr 11, 2023·1 cites·19 claims
- 2275US10242845B2Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamberLAM RES CORP·Filed 2017·Granted Mar 26, 2019·2 cites·15 claims
- 2375US2024404821A1Semiconductor substrate bevel cleaningLAM RES CORP·Filed 2024·Application pending·0 cites
- 2473US11495441B2Systems for cooling RF heated chamber componentsLAM RES CORP·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 2572US11692732B2Air cooled faraday shield and methods for using the sameLAM RES CORP·Filed 2020·Granted Jul 4, 2023·0 cites·10 claims
- 2670US10249511B2Ceramic showerhead including central gas injector for tunable convective-diffusive gas flow in semiconductor substrate processing apparatusLAM RES CORP·Filed 2014·Granted Apr 2, 2019·2 cites·8 claims
- 2770US2023205076A1Resist and etch modelingLAM RES CORP·Filed 2023·Application pending·0 cites
- 2867US9275869B2Fast-gas switching for etchingLAM RES CORP·Filed 2013·Granted Mar 1, 2016·1 cites·16 claims
- 2967US2023121097A1Multi-zone cooling of plasma heated windowLAM RES CORP·Filed 2022·Application pending·0 cites
- 3066US12068152B2Semiconductor substrate bevel cleaningLAM RES CORP·Filed 2020·Granted Aug 20, 2024·0 cites·9 claims
- 3163US10825661B2Systems for cooling RF heated chamber componentsLAM RES CORP·Filed 2018·Granted Nov 3, 2020·0 cites·19 claims
- 3262US10690374B2Air cooled faraday shield and methods for using the sameLAM RES CORP·Filed 2018·Granted Jun 23, 2020·0 cites·15 claims
- 3362US2022270863A1Moveable edge rings with reduced capacitance variation for substrate processing systemsLAM RES CORP·Filed 2022·Application pending·0 cites
- 3459US11424103B2Control of on-wafer cd uniformity with movable edge ring and gas injection adjustmentLAM RES CORP·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
- 3557US11171021B2Internal plasma grid for semiconductor fabricationLAM RES CORP·Filed 2015·Granted Nov 9, 2021·0 cites·21 claims
- 3657US2014302681A1Internal plasma grid for semiconductor fabricationLAM RES CORP·Filed 2013·Application pending·0 cites
- 3754US9640408B2Fast-gas switching for etchingLAM RES CORP·Filed 2016·Granted May 2, 2017·0 cites·10 claims
- 3854US2022254612A1Moveable edge rings with reduced capacitance variation for substrate processing systemsLAM RES CORP·Filed 2020·Application pending·0 cites
- 3953US10460951B2Gas reaction trajectory control through tunable plasma dissociation for wafer by-product distribution and etch feature profile uniformityLAM RES CORP·Filed 2018·Granted Oct 29, 2019·0 cites·20 claims
- 4053US2023245854A1Hybrid liquid/air cooling system for tcp windowsLAM RES CORP·Filed 2022·Application pending·0 cites
- 4151US11538666B2Multi-zone cooling of plasma heated windowLAM RES CORP·Filed 2017·Granted Dec 27, 2022·0 cites·19 claims
- 4246US2022328290A1Moveable edge rings for substrate processing systemsLAM RES COPORATION·Filed 2020·Application pending·0 cites
- 4342US2022285136A1Edge ring systems for substrate processing systemsLAM RES CORP·Filed 2020·Application pending·0 cites
- 4439US2019049937A1Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimizationLAM RES CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →