Inventor · disambiguated record
Sadamichi Takakusaki
Also filed as: TAKAKUSAKI SADAMICHI
21 granted patents·6 pending applications·117 citations·filing 2003–2022
94Inventor score
Files withSANYO ELECTRIC CO14SEMICONDUCTOR COMPONENTS IND LLC7TAKAKUSAKI SADAMICHI4NAKASATO MAYUMI1SEMICONDUCTOR COMPONENTS IND1
Top patents by PatentIndex Score
27 records- 0188US7221049B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted May 22, 2007·17 cites·9 claims
- 0286US7957158B2Circuit deviceSANYO ELECTRIC CO·Filed 2007·Granted Jun 7, 2011·16 cites·12 claims
- 0385US9397017B2Substrate structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2015·Granted Jul 19, 2016·5 cites·4 claims
- 0485US7186921B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Mar 6, 2007·13 cites·2 claims
- 0582US7964957B2Circuit substrate, circuit device and manufacturing process thereofSANYO ELECTRIC CO·Filed 2008·Granted Jun 21, 2011·12 cites·22 claims
- 0682US7521290B2Method of manufacturing circuit deviceSANYO ELECTRIC CO·Filed 2007·Granted Apr 21, 2009·11 cites·6 claims
- 0780US7936569B2Circuit device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2006·Granted May 3, 2011·10 cites·10 claims
- 0878US12414238B2Substrate structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 0971US7714232B2Circuit device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2005·Granted May 11, 2010·6 cites·4 claims
- 1069US8203848B2Circuit device and method of manufacturing the sameTAKAKUSAKI SADAMICHI·Filed 2006·Granted Jun 19, 2012·6 cites·8 claims
- 1166US2022375833A1Substrate structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 1265US7851921B2Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting boardSANYO ELECTRIC CO·Filed 2007·Granted Dec 14, 2010·2 cites·9 claims
- 1360US7250352B2Methods for manufacturing a hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2003·Granted Jul 31, 2007·11 cites·28 claims
- 1458US11419217B2Substrate structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Aug 16, 2022·0 cites·10 claims
- 1558US9408301B2Substrate structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Aug 2, 2016·0 cites·4 claims
- 1655US9883595B2Substrate structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jan 30, 2018·0 cites·5 claims
- 1755US6956252B2Hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2003·Granted Oct 18, 2005·8 cites·31 claims
- 1853US11101139B2Etched nickel plated substrate and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Aug 24, 2021·0 cites·15 claims
- 1950US8183090B2Methods for manufacturing device mounting board and circuit substrateNAKASATO MAYUMI·Filed 2010·Granted May 22, 2012·0 cites·8 claims
- 2049US11437304B2Substrate structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Sep 6, 2022·0 cites·8 claims
- 2145US7999190B2Light emitting module and method for manufacturing the sameSANYO ELECTRIC CO·Filed 2008·Granted Aug 16, 2011·0 cites·10 claims
- 2243US2011121335A1Light emitting module and manufacturing method thereofSANYO ELECTRIC CO·Filed 2008·Application pending·0 cites
- 2341US2007221704A1Method of manufacturing circuit deviceSANYO ELECTRIC CO·Filed 2006·Application pending·0 cites
- 2440US7163841B2Method of manufacturing circuit deviceSANYO ELECTRIC CO·Filed 2005·Granted Jan 16, 2007·0 cites·7 claims
- 2534US2012018201A1Circuit board and manufacturing method thereof, circuit device and manufacturing method thereof, and conductive foil provided with insulating layerTAKAKUSAKI SADAMICHI·Filed 2011·Application pending·0 cites
- 2633US2008123299A1Circuit Device and Manufacturing Method of the SameTAKAKUSAKI SADAMICHI·Filed 2005·Application pending·0 cites
- 2732US2005263482A1Method of manufacturing circuit deviceTAKAKUSAKI SADAMICHI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →