Inventor · disambiguated record
Samantha Tan
Also filed as: TAN SAMANTHA · TAN SAMANTHA S H · TAN SAMANTHA SIAMHWA
58 granted patents·21 pending applications·1,074 citations·filing 2014–2025
99Inventor score
Files withLAM RES CORP79
Top patents by PatentIndex Score
79 records- 0199US9997357B2Capped ALD films for doping fin-shaped channel regions of 3-D IC transistorsLAM RES CORP·Filed 2014·Granted Jun 12, 2018·430 cites·22 claims
- 0299US9396961B2Integrated etch/clean for dielectric etch applicationsLAM RES CORP·Filed 2015·Granted Jul 19, 2016·105 cites·26 claims
- 0398US12278125B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Apr 15, 2025·8 cites·19 claims
- 0498US12183604B2Integrated dry processes for patterning radiation photoresist patterningLAM RES CORP·Filed 2023·Granted Dec 31, 2024·9 cites·37 claims
- 0598US12094711B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2022·Granted Sep 17, 2024·5 cites·18 claims
- 0698US11069535B2Atomic layer etch of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2020·Granted Jul 20, 2021·7 cites·19 claims
- 0798US9805941B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2017·Granted Oct 31, 2017·44 cites·26 claims
- 0898US9806252B2Dry plasma etch method to pattern MRAM stackLAM RES CORP·Filed 2015·Granted Oct 31, 2017·61 cites·20 claims
- 0998US9576811B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2015·Granted Feb 21, 2017·65 cites·26 claims
- 1097US12105422B2Photoresist development with halide chemistriesLAM RES CORP·Filed 2020·Granted Oct 1, 2024·13 cites·12 claims
- 1197US10559468B2Capped ALD films for doping fin-shaped channel regions of 3-D IC transistorsLAM RES CORP·Filed 2018·Granted Feb 11, 2020·13 cites·21 claims
- 1297US10546748B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2018·Granted Jan 28, 2020·25 cites·20 claims
- 1397US10374144B2Dry plasma etch method to pattern MRAM stackLAM RES CORP·Filed 2017·Granted Aug 6, 2019·21 cites·16 claims
- 1497US10186426B2Integrating atomic scale processes: ALD (atomic layer deposition) and ale (atomic layer etch)LAM RES CORP·Filed 2017·Granted Jan 22, 2019·16 cites·21 claims
- 1597US10096487B2Atomic layer etching of tungsten and other metalsLAM RES CORP·Filed 2016·Granted Oct 9, 2018·24 cites·16 claims
- 1697US9972504B2Atomic layer etching of tungsten for enhanced tungsten deposition fillLAM RES CORP·Filed 2015·Granted May 15, 2018·21 cites·19 claims
- 1797US9837312B1Atomic layer etching for enhanced bottom-up feature fillLAM RES CORP·Filed 2016·Granted Dec 5, 2017·48 cites·20 claims
- 1896US12183589B2Tin oxide mandrels in patterningLAM RES CORP·Filed 2021·Granted Dec 31, 2024·3 cites·20 claims
- 1996US11322351B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2019·Granted May 3, 2022·15 cites·32 claims
- 2096US10763083B2High energy atomic layer etchingLAM RES CORP·Filed 2018·Granted Sep 1, 2020·15 cites·22 claims
- 2196US10749103B2Dry plasma etch method to pattern MRAM stackLAM RES CORP·Filed 2019·Granted Aug 18, 2020·7 cites·10 claims
- 2296US10269566B2Etching substrates using ale and selective depositionLAM RES CORP·Filed 2017·Granted Apr 23, 2019·15 cites·24 claims
- 2395US12510825B2Photoresist development with halide chemistriesLAM RES CORP·Filed 2024·Granted Dec 30, 2025·2 cites·33 claims
- 2495US12510826B2Photoresist development with halide chemistriesLAM RES CORP·Filed 2024·Granted Dec 30, 2025·2 cites·12 claims
- 2595US11355353B2Tin oxide mandrels in patterningLAM RES CORP·Filed 2019·Granted Jun 7, 2022·15 cites·15 claims
- 2695US10685836B2Etching substrates using ALE and selective depositionLAM RES CORP·Filed 2019·Granted Jun 16, 2020·10 cites·20 claims
- 2795US10056264B2Atomic layer etching of GaN and other III-V materialsLAM RES CORP·Filed 2016·Granted Aug 21, 2018·20 cites·20 claims
- 2895US9984858B2ALE smoothness: in and outside semiconductor industryLAM RES CORP·Filed 2016·Granted May 29, 2018·10 cites·20 claims
- 2994US12119243B2Plasma etching chemistries of high aspect ratio features in dielectricsLAM RES CORP·Filed 2023·Granted Oct 15, 2024·1 cites·5 claims
- 3094US10515816B2Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)LAM RES CORP·Filed 2018·Granted Dec 24, 2019·6 cites·18 claims
- 3193US11842888B2Removing metal contamination from surfaces of a processing chamberLAM RES CORP·Filed 2022·Granted Dec 12, 2023·1 cites·24 claims
- 3291US12211691B2Dry development of resistsLAM RES CORP·Filed 2019·Granted Jan 28, 2025·8 cites·12 claims
- 3390US12437995B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2022·Granted Oct 7, 2025·1 cites·5 claims
- 3489US10727073B2Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfacesLAM RES CORP·Filed 2017·Granted Jul 28, 2020·5 cites·20 claims
- 3589US10304659B2Ale smoothness: in and outside semiconductor industryLAM RES CORP·Filed 2018·Granted May 28, 2019·4 cites·20 claims
- 3688US11935758B2Atomic layer etching for subtractive metal etchLAM RES CORP·Filed 2020·Granted Mar 19, 2024·2 cites·7 claims
- 3787US12417916B2Tin oxide films in semiconductor device manufacturingLAM RES CORP·Filed 2021·Granted Sep 16, 2025·1 cites·16 claims
- 3887US12191125B2Removing metal contamination from surfaces of a processing chamberLAM RES CORP·Filed 2023·Granted Jan 7, 2025·0 cites·18 claims
- 3985US11011379B2Capped ALD films for doping fin-shaped channel regions of 3-D IC transistorsLAM RES CORP·Filed 2019·Granted May 18, 2021·2 cites·12 claims
- 4085US10825680B2Directional deposition on patterned structuresLAM RES CORP·Filed 2018·Granted Nov 3, 2020·3 cites·21 claims
- 4184US11670516B2Metal-containing passivation for high aspect ratio etchLAM RES CORP·Filed 2019·Granted Jun 6, 2023·3 cites·20 claims
- 4284US11450513B2Atomic layer etching and smoothing of refractory metals and other high surface binding energy materialsLAM RES CORP·Filed 2019·Granted Sep 20, 2022·3 cites·7 claims
- 4384US2025379042A1Method of cleaning chamber components with metal etch residuesLAM RES CORP·Filed 2025·Application pending·0 cites
- 4483US12080562B2Atomic layer etch and ion beam etch patterningLAM RES CORP·Filed 2020·Granted Sep 3, 2024·1 cites·16 claims
- 4581US12266542B2Atomic layer etching for subtractive metal etchLAM RES CORP·Filed 2024·Granted Apr 1, 2025·0 cites·9 claims
- 4681US2020161139A1Integrating atomic scale processes: ald (atomic layer deposition) and ale (atomic layer etch)LAM RES CORP·Filed 2019·Application pending·0 cites
- 4781US2024178014A1Plasma etching chemistries of high aspect ratio features in dielectricsLAM RES CORP·Filed 2024·Application pending·0 cites
- 4879US10043672B2Selective self-aligned patterning of silicon germanium, germanium and type III/V materials using a sulfur-containing maskLAM RES CORP·Filed 2016·Granted Aug 7, 2018·2 cites·24 claims
- 4978US12027375B2Selective etch using a sacrificial maskLAM RES CORP·Filed 2020·Granted Jul 2, 2024·1 cites·21 claims
- 5077US11594429B2Plasma etching chemistries of high aspect ratio features in dielectricsLAM RES CORP·Filed 2019·Granted Feb 28, 2023·1 cites·12 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →