Inventor · disambiguated record
Satoru Tomekawa
Also filed as: TOMEKAWA SATORU
28 granted patents·10 pending applications·341 citations·filing 2000–2020
97Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD22PANASONIC CORP9HIRAI SHOGO2KYOTO ELEX CO LTD2HIMORI TSUYOSHI1
Top patents by PatentIndex Score
38 records- 0192US7184617B2Portable deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Feb 27, 2007·29 cites·6 claims
- 0291US7773386B2Flexible substrate, multilayer flexible substratePANASONIC CORP·Filed 2007·Granted Aug 10, 2010·13 cites·11 claims
- 0390US7205483B2Flexible substrate having interlaminar junctions, and process for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 17, 2007·17 cites·20 claims
- 0490US6774316B1Wiring board and production method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 10, 2004·50 cites·27 claims
- 0590US6518514B2Circuit board and production of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 11, 2003·48 cites·17 claims
- 0688US7799607B2Process for forming bumps and solder bumpPANASONIC CORP·Filed 2005·Granted Sep 21, 2010·16 cites·21 claims
- 0788US6691409B2Method of producing a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 17, 2004·40 cites·9 claims
- 0884US11739232B2Conductive paste compositionKYOTO ELEX CO LTD·Filed 2020·Granted Aug 29, 2023·2 cites·6 claims
- 0984US6558780B2Circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 6, 2003·24 cites·11 claims
- 1083US7759162B2Flip chip mounting process and flip chip assemblyPANASONIC CORP·Filed 2005·Granted Jul 20, 2010·10 cites·3 claims
- 1181US8563872B2Wiring board, wiring board manufacturing method, and via pasteHIRAI SHOGO·Filed 2011·Granted Oct 22, 2013·8 cites·17 claims
- 1281US7969741B2Substrate structurePANASONIC CORP·Filed 2006·Granted Jun 28, 2011·11 cites·7 claims
- 1378US7531754B2Flexible substrate having interlaminar junctions, and process for producing the samePANASONIC CORP·Filed 2007·Granted May 12, 2009·6 cites·11 claims
- 1475US6996902B2Method for manufacturing a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 14, 2006·14 cites·8 claims
- 1573US7321496B2Flexible substrate, multilayer flexible substrate and process for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 22, 2008·3 cites·15 claims
- 1671US8604350B2Multilayer wiring substrate and manufacturing method of multilayer wiring substrateHIMORI TSUYOSHI·Filed 2011·Granted Dec 10, 2013·3 cites·15 claims
- 1769US6930395B2Circuit substrate having improved connection reliability and a method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 16, 2005·13 cites·10 claims
- 1868US7103971B2Process for manufacturing a circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Sep 12, 2006·2 cites·4 claims
- 1962US8012801B2Flip chip mounting process and flip chip assemblyPANASONIC CORP·Filed 2010·Granted Sep 6, 2011·1 cites·10 claims
- 2062US6596381B2Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jul 22, 2003·6 cites·18 claims
- 2158US7752749B2Electronic component mounting method and electronic component mounting devicePANASONIC CORP·Filed 2006·Granted Jul 13, 2010·2 cites·25 claims
- 2257US6713688B2Circuit board and its manufacture methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 30, 2004·6 cites·12 claims
- 2353US7056571B2Wiring board and its production processMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 6, 2006·11 cites·17 claims
- 2453US7047629B2Method of manufacturing circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 23, 2006·4 cites·4 claims
- 2553US2008185178A1Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipmentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 2653US2006283626A1Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 2751US6686029B2Circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 3, 2004·2 cites·10 claims
- 2848US7522938B2Portable information terminal apparatusPANASONIC CORP·Filed 2005·Granted Apr 21, 2009·0 cites·10 claims
- 2946US10707360B2Thermosetting electroconductive paste composition, and solar cell and solar cell module both using the sameKYOTO ELEX CO LTD·Filed 2018·Granted Jul 7, 2020·0 cites·8 claims
- 3044US2005124197A1Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipmentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 3144US2013008698A1Multilayer wiring board, production method of the same, and via pastePANASONIC CORP·Filed 2011·Application pending·0 cites
- 3243US6866892B2Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 15, 2005·0 cites·3 claims
- 3342US2009032285A1Multi-layer circuit substrate manufacturing method and multi-layer circuit substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 3441US2005014035A1Prepreg for printed wiring board, printed wiring board using the prepreg and method for manufacturing the printed wiring board, and multilayer printed wiring board and method for manufacturing the multilayer printed wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 3539US2010044100A1Board structure and electronic deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 3639US2013068513A1Wiring board, production method of the same, and via pasteHIRAI SHOGO·Filed 2011·Application pending·0 cites
- 3734US2006091524A1Semiconductor module, process for producing the same, and film interposerKARASHIMA SEIJI·Filed 2005·Application pending·0 cites
- 3833US2004020046A1Production method for conductive paste and production method for printed circuitFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Satoru Tomekawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →