Inventor · disambiguated record
Saifi Usmani
Also filed as: USMANI SAIFI
7 granted patents·5 pending applications·51 citations·filing 2003–2016
82Inventor score
Technology areasH10P
Files withAIR PROD & CHEM4DUPONT AIR PROD NANOMATERIALS2FREESCALE SEMICONDUCTOR INC2SIDDIQUI JUNAID AHMED2
Top patents by PatentIndex Score
12 records- 0189US7915071B2Method for chemical mechanical planarization of chalcogenide materialsDUPONT AIR PROD NANOMATERIALS·Filed 2008·Granted Mar 29, 2011·17 cites·15 claims
- 0286US7579279B2Method to passivate conductive surfaces during semiconductor processingFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Aug 25, 2009·11 cites·16 claims
- 0379US7188630B2Method to passivate conductive surfaces during semiconductor processingFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Mar 13, 2007·21 cites·13 claims
- 0473US9062230B2Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereofAIR PROD & CHEM·Filed 2014·Granted Jun 23, 2015·2 cites·9 claims
- 0554US10011741B2Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereofAIR PROD & CHEM·Filed 2016·Granted Jul 3, 2018·0 cites·8 claims
- 0654US8859428B2Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereofAIR PROD & CHEM·Filed 2013·Granted Oct 14, 2014·0 cites·8 claims
- 0752US9305476B2Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereofAIR PROD & CHEM·Filed 2015·Granted Apr 5, 2016·0 cites·11 claims
- 0846US2005194563A1Bicine/tricine containing composition and method for chemical-mechanical planarizationFiled 2005·Application pending·0 cites
- 0946US2008149884A1Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishingSIDDIQUI JUNAID AHMED·Filed 2006·Application pending·0 cites
- 1044US2011165777A1Method and Slurry for Tuning Low-K Versus Copper Removal Rates During Chemical Mechanical PolishingDUPONT AIR PROD NANOMATERIALS·Filed 2011·Application pending·0 cites
- 1141US2005076579A1Bicine/tricine containing composition and method for chemical-mechanical planarizationFiled 2003·Application pending·0 cites
- 1239US2008148652A1Compositions for chemical mechanical planarization of copperSIDDIQUI JUNAID AHMED·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →