Inventor · disambiguated record
Samuel Wilson
Also filed as: WILSON SAMUEL · WILSON SAMUEL C
4 granted patents·558 citations·filing 1996–2000
84Inventor score
Files withAPPLIED MATERIALS INC4
Top patents by PatentIndex Score
4 records- 0196US6110530ACVD method of depositing copper films by using improved organocopper precursor blendAPPLIED MATERIALS INC·Filed 1999·Granted Aug 29, 2000·272 cites·4 claims
- 0294US6464790B1Substrate support memberAPPLIED MATERIALS INC·Filed 2000·Granted Oct 15, 2002·126 cites·23 claims
- 0390US5740009AApparatus for improving wafer and chuck edge protectionAPPLIED MATERIALS INC·Filed 1996·Granted Apr 14, 1998·117 cites·24 claims
- 0472US6319728B1Method for treating a deposited film for resistivity reductionAPPLIED MATERIALS INC·Filed 1998·Granted Nov 20, 2001·43 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →