Inventor · disambiguated record
Sean Chang
Also filed as: CHANG SEAN · CHANG SEAN PING
11 granted patents·969 citations·filing 2004–2023
92Inventor score
Top patents by PatentIndex Score
11 records- 0198US8435894B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2012·Granted May 7, 2013·314 cites·13 claims
- 0297US8835317B2Depositing tungsten into high aspect ratio featuresNOVELLUS SYSTEMS INC·Filed 2013·Granted Sep 16, 2014·33 cites·23 claims
- 0397US8124531B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2011·Granted Feb 28, 2012·64 cites·20 claims
- 0496US9034768B2Depositing tungsten into high aspect ratio featuresCHANDRASHEKAR ANAND·Filed 2010·Granted May 19, 2015·32 cites·21 claims
- 0595US8207062B2Method for improving adhesion of low resistivity tungsten/tungsten nitride layersGAO JUWEN·Filed 2009·Granted Jun 26, 2012·46 cites·15 claims
- 0695US8119527B1Depositing tungsten into high aspect ratio featuresCHADRASHEKAR ANAND·Filed 2009·Granted Feb 21, 2012·452 cites·19 claims
- 0787US8889233B1Method for reducing stress in porous dielectric filmsKELMAN MAXIM·Filed 2006·Granted Nov 18, 2014·16 cites·26 claims
- 0886US11865773B2Additive process for circular printing of electronic devicesTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 9, 2024·3 cites·24 claims
- 0977US12172374B2Additive process for circular printingTEXAS INSTRUMENTS INC·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 1063US9659769B1Tensile dielectric films using UV curingVARADARAJAN BHADRI·Filed 2004·Granted May 23, 2017·9 cites·35 claims
- 1146US11487206B2Methods and apparatus for digital material deposition onto semiconductor wafersTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 1, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →