Inventor · disambiguated record
Seung-Man Choi
Also filed as: CHOI SEUNG · CHOI SEUNG-MAN
24 granted patents·13 pending applications·283 citations·filing 2001–2024
96Inventor score
Files withSAMSUNG ELECTRONICS CO LTD23CHEIL IND INC2HYUNDAI KEFICO CORP2CHOI SEUNG-MAN1GLOBAL FOUNDRIES INC1
Top patents by PatentIndex Score
37 records- 0194US7911001B2Methods for forming self-aligned dual stress liners for CMOS semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 22, 2011·29 cites·13 claims
- 0294US7332764B2Metal-insulator-metal (MIM) capacitor and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 19, 2008·38 cites·22 claims
- 0392US7514354B2Methods for forming damascene wiring structures having line and plug conductors formed from different materialsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 7, 2009·25 cites·21 claims
- 0491US7586175B2Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surfaceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 8, 2009·19 cites·14 claims
- 0589US6787460B2Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formedSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 7, 2004·44 cites·24 claims
- 0688US7335590B2Method of fabricating semiconductor device by forming diffusion barrier layer selectively and semiconductor device fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 26, 2008·21 cites·40 claims
- 0785US8877559B2Through-silicon via with sidewall air gapGLOBAL FOUNDRIES INC·Filed 2013·Granted Nov 4, 2014·6 cites·17 claims
- 0883US6548905B2Semiconductor device having multi-layer copper line and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 15, 2003·30 cites·6 claims
- 0980US7387962B2Physical vapor deposition methods for forming hydrogen-stuffed trench liners for copper-based metallizationSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 17, 2008·9 cites·14 claims
- 1079US9625624B2Color improving film and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 18, 2017·4 cites·17 claims
- 1178US9349993B2Film for improving color display and method for manufacturing the same, and display apparatus including improved color display filmSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 24, 2016·4 cites·20 claims
- 1277US9348066B2Film for improving color display and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 24, 2016·3 cites·19 claims
- 1377US7781276B2Methods of forming CMOS integrated circuits that utilize insulating layers with high stress characteristics to improve NMOS and PMOS transistor carrier mobilitiesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 24, 2010·4 cites·4 claims
- 1477US6884710B2Semiconductor device having multi-layer copper line and method of forming sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 26, 2005·21 cites·10 claims
- 1574US7051934B2Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recessesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 30, 2006·15 cites·28 claims
- 1671US10030721B2Method and apparatus for controlling dual clutch transmissionHYUNDAI AUTRON CO LTD·Filed 2015·Granted Jul 24, 2018·1 cites·12 claims
- 1769US7446033B2Method of forming a metal interconnection of a semiconductor device, and metal interconnection formed by such methodSAMUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 4, 2008·4 cites·40 claims
- 1866US7864266B2Diffuser plate, backlight and display having the sameCHEIL IND INC·Filed 2008·Granted Jan 4, 2011·2 cites·20 claims
- 1966US7365025B2Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 29, 2008·2 cites·11 claims
- 2063US11193582B2Controlling apparatus and method for electric shift-by-wire systemHYUNDAI KEFICO CORP·Filed 2020·Granted Dec 7, 2021·0 cites·10 claims
- 2161US7341908B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 11, 2008·1 cites·34 claims
- 2259US2025014995A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2358US7417302B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 26, 2008·1 cites·20 claims
- 2457US9437524B2Through-silicon via with sidewall air gapGLOBALFOUNDRIES INC·Filed 2014·Granted Sep 6, 2016·0 cites·11 claims
- 2555US11614163B2Motor control method and device for shift-by-wire systemHYUNDAI KEFICO CORP·Filed 2022·Granted Mar 28, 2023·0 cites·8 claims
- 2651US2008116521A1CMOS Integrated Circuits that Utilize Insulating Layers with High Stress Characteristics to Improve NMOS and PMOS Transistor Carrier Mobilities and Methods of Forming SameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2751US2014355124A1Color improving film and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2847US2010140747A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2945US2014160574A1Optical sheet, backlight unit including the same, and display apparatus including the sameCHEIL IND INC·Filed 2013·Application pending·0 cites
- 3044US2011163387A1Methods for forming self-aligned dual stress liners for cmos semiconductor devicesLEE KYOUNG WOO·Filed 2011·Application pending·0 cites
- 3142US2007202689A1Methods of forming copper vias with argon sputtering etching in dual damascene processesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3242US2009128914A1Diffuser plate, backlight and display have the sameLEE KYUNG JOON·Filed 2008·Application pending·0 cites
- 3341US2007072413A1Methods of forming copper interconnect structures on semiconductor substratesCHOI SEUNG-MAN·Filed 2005·Application pending·0 cites
- 3440US2005012166A1Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 3537US2008008845A1Light diffusion sheet for a display deviceOH YOUNG·Filed 2007·Application pending·0 cites
- 3636US2002041028A1Method for forming damascene interconnection of semiconductor device and damascene interconnection fabricated therebyFiled 2001·Application pending·0 cites
- 3736US2016033707A1Light guide plate, method for fabricating the same, backlight unit including the same, and liquid crystal display including the sameSAMSUNG SDI CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →