Inventor · disambiguated record
Seishi Fujimaki
Also filed as: FUJIMAKI SEISHI
2 granted patents·2 pending applications·62 citations·filing 2004–2010
68Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0192US7382044B1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2006·Granted Jun 3, 2008·24 cites·8 claims
- 0286US7122406B1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2004·Granted Oct 17, 2006·38 cites·10 claims
- 0351US2008142936A1Semiconductor device package diepad having features formed by electroplatingGEM SERVICES INC·Filed 2008·Application pending·0 cites
- 0446US2011003439A1Semiconductor device package having features formed by electroplatingGEM Services·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →