Inventor · disambiguated record
Seyed H. Hashemi
Also filed as: HASHEMI SEYED H · HASHEMI SEYED HASSAN
10 granted patents·1 pending application·419 citations·filing 1990–2004
92Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0187US5344795AMethod for encapsulating an integrated circuit using a removable heatsink support blockMICROELECTRONICS & COMPUTER·Filed 1992·Granted Sep 6, 1994·99 cites·32 claims
- 0282US5403784AProcess for manufacturing a stacked multiple leadframe semiconductor package using an alignment templateMICROELECTRONICS & COMPUTER·Filed 1993·Granted Apr 4, 1995·73 cites·23 claims
- 0381US5049979ACombined flat capacitor and tab integrated circuit chip and methodMICROELECTRONICS & COMPUTER·Filed 1990·Granted Sep 17, 1991·68 cites·19 claims
- 0479US6261871B1Method and structure for temperature stabilization in flip chip technologyCONEXANT SYSTEMS INC·Filed 2000·Granted Jul 17, 2001·30 cites·12 claims
- 0567US6848500B1Cooling system for pulsed power electronicsSKYWORKS SOLUTIONS INC·Filed 1999·Granted Feb 1, 2005·37 cites·14 claims
- 0667US5309321AThermally conductive screen mesh for encapsulated integrated circuit packagesMICROELECTRONICS & COMPUTER·Filed 1992·Granted May 3, 1994·37 cites·31 claims
- 0763US6359343B1Temperature stabilization in flip chip technologyCONEXANT SYSTEMS INC·Filed 2001·Granted Mar 19, 2002·11 cites·21 claims
- 0863US5265321AIntegrated circuit structure with heat exchanger elements secured thereto and method of makingMICROELECTRONICS & COMPUTER·Filed 1992·Granted Nov 30, 1993·32 cites·20 claims
- 0956US5383269AMethod of making three dimensional integrated circuit interconnect moduleMICROELECTRONICS & COMPUTER·Filed 1993·Granted Jan 24, 1995·30 cites·9 claims
- 1044US6586847B1Method and structure for temperature stabilization in semiconductor devicesSKYWORKS SOLUTIONS INC·Filed 2000·Granted Jul 1, 2003·2 cites·7 claims
- 1136US2005253245A1Package design and method for electrically connecting die to packageLYNCH MARK·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →