Inventor · disambiguated record
Sell Jung
Also filed as: JUNG SELL
4 granted patents·1 citations·filing 2013–2024
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0182US12385128B2Cooling device and process for cooling double-sided SiP devices during sputteringSTATS CHIPPAC PTE LTD·Filed 2024·Granted Aug 12, 2025·0 cites·24 claims
- 0275US11932933B2Cooling device and process for cooling double-sided SiP devices during sputteringSTATS CHIPPAC PTE LTD·Filed 2022·Granted Mar 19, 2024·0 cites·23 claims
- 0368US11434561B2Cooling device and process for cooling double-sided SiP devices during sputteringSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 6, 2022·0 cites·24 claims
- 0460US9093415B2Integrated circuit packaging system with heat spreader and method of manufacture thereofKIM OH HAN·Filed 2013·Granted Jul 28, 2015·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →