Inventor · disambiguated record
Seiji Kai
Also filed as: KAI SEIJI
27 granted patents·9 pending applications·63 citations·filing 1997–2024
94Inventor score
Files withMURATA MANUFACTURING CO27SANYO ELECTRIC CO6OKI ELECTRIC IND CO LTD2NIPPON SHEET GLASS CO LTD1
Top patents by PatentIndex Score
36 records- 0190US10243536B2Elastic wave device and manufacturing method thereofMURATA MANUFACTURING CO·Filed 2016·Granted Mar 26, 2019·8 cites·21 claims
- 0286US10148245B2Elastic wave deviceMURATA MANUFACTURING CO·Filed 2016·Granted Dec 4, 2018·6 cites·20 claims
- 0382US10707830B2Elastic wave device and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2016·Granted Jul 7, 2020·4 cites·13 claims
- 0481US10862455B2Elastic wave deviceMURATA MANUFACTURING CO·Filed 2017·Granted Dec 8, 2020·3 cites·18 claims
- 0579US10958240B2Elastic wave deviceMURATA MANUFACTURING CO·Filed 2017·Granted Mar 23, 2021·3 cites·14 claims
- 0679US10637432B2Elastic wave deviceMURATA MANUFACTURING CO·Filed 2017·Granted Apr 28, 2020·3 cites·18 claims
- 0775US10659001B2Elastic wave deviceMURATA MANUFACTURING CO·Filed 2017·Granted May 19, 2020·2 cites·18 claims
- 0874US10374142B2Surface acoustic wave device and manufacturing method thereforMURATA MANUFACTURING CO·Filed 2016·Granted Aug 6, 2019·3 cites·10 claims
- 0965US6785441B2Optical fiber collimatorNIPPON SHEET GLASS CO LTD·Filed 2001·Granted Aug 31, 2004·12 cites·18 claims
- 1064US9271400B2Electronic component and manufacturing method thereforMURATA MANUFACTURING CO·Filed 2013·Granted Feb 23, 2016·2 cites·20 claims
- 1164US7138670B2Semiconductor device for use in a solid state imaging deviceSANYO ELECTRIC CO·Filed 2005·Granted Nov 21, 2006·3 cites·5 claims
- 1260US12431860B2Acoustic wave deviceMURATA MANUFACTURING CO·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 1360US12413206B2Acoustic wave deviceMURATA MANUFACTURING CO·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 1458US2024186979A1Acoustic wave device and method of manufacturing acoustic wave deviceMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1557US10644669B2Elastic wave deviceMURATA MANUFACTURING CO·Filed 2019·Granted May 5, 2020·0 cites·8 claims
- 1657US2024030893A1Acoustic wave deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 1757US2024030890A1Acoustic wave deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 1856US2024014799A1Acoustic wave deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 1956US2024007082A1Acoustic wave device and method for manufacturing acoustic wave deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 2055US2023261630A1Acoustic wave deviceMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 2148US11245380B2Acoustic wave device, high-frequency front-end circuit, and communication deviceMURATA MANUFACTURING CO·Filed 2020·Granted Feb 8, 2022·0 cites·20 claims
- 2248US10659002B2Elastic wave deviceMURATA MANUFACTURING CO·Filed 2018·Granted May 19, 2020·0 cites·19 claims
- 2348US10320355B2Method of manufacturing elastic wave deviceMURATA MANUFACTURING CO·Filed 2015·Granted Jun 11, 2019·0 cites·12 claims
- 2448US2007075382A1Integrated circuit and method for manufacturing the sameSANYO ELECTRIC CO·Filed 2006·Application pending·0 cites
- 2547US6995915B2Manufacturing method of micro-lens, manufacturing method of solid-state image pickup device and solid-state image pickup deviceSANYO ELECTRIC CO·Filed 2004·Granted Feb 7, 2006·2 cites·8 claims
- 2646US11626851B2Acoustic wave device, high-frequency front end circuit, communication device, and method for manufacturing acoustic wave deviceMURATA MANUFACTURING CO·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 2746US2006103941A1Microlens manufacturing method and solid-state image pickup device manufacturing methodSANYO ELECTRIC CO·Filed 2005·Application pending·0 cites
- 2845US7459327B2Method for manufacturing micro lenses including underlayer film and lens film etching stepsSANYO ELECTRIC CO·Filed 2004·Granted Dec 2, 2008·3 cites·3 claims
- 2944US11588460B2Elastic wave device manufacturing method, elastic wave device, radio-frequency front-end circuit, and communication deviceMURATA MANUFACTURING CO·Filed 2019·Granted Feb 21, 2023·0 cites·19 claims
- 3044US11539343B2Acoustic wave device, high-frequency front-end circuit, and communication deviceMURATA MANUFACTURING CO·Filed 2020·Granted Dec 27, 2022·0 cites·14 claims
- 3141US2015037921A1Method for manufacturing acoustic wave deviceMURATA MANUFACTURING CO·Filed 2014·Application pending·0 cites
- 3240US9876484B2Elastic wave device with first and second support layers providing a hollow pathMURATA MANUFACTURING CO·Filed 2016·Granted Jan 23, 2018·0 cites·16 claims
- 3338US10622965B2Surface acoustic wave device assemblyMURATA MANUFACTURING CO·Filed 2017·Granted Apr 14, 2020·0 cites·20 claims
- 3436US7348133B2Method of manufacturing solid-state image sensing deviceSANYO ELECTRIC CO·Filed 2004·Granted Mar 25, 2008·2 cites·14 claims
- 3534US5949106AFET input/output pad layoutOKI ELECTRIC IND CO LTD·Filed 1997·Granted Sep 7, 1999·5 cites·18 claims
- 3632US5886372ASemiconductor device having two composite field effect transistorsOKI ELECTRIC IND CO LTD·Filed 1997·Granted Mar 23, 1999·2 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →