Electronic component and manufacturing method therefor

Abstract

An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.

What is claimed is: 
     
       1. An electronic component comprising:
 a substrate; 
 a functional unit located on one main surface of the substrate; 
 a frame-shaped supporting body including a heat-curable resin that is arranged on the one main surface of the substrate so as to surround the functional unit and so as to be separated from a periphery of the substrate on an inner side; and 
 a lid member that is fixed to the supporting body so as to seal an opening of the supporting body; wherein 
 the frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that is provided at a portion in which the supporting body main body and the first protrusion are continuous with each other so as to protrude toward an outside from the supporting body main body, 
 wherein the second protrusion is configured to prevent occurrence of leak defects. 
 
     
     
       2. The electronic component according to  claim 1 , further comprising a penetrating electrode that is electrically connected to the functional unit and penetrates through the first protrusion and the lid member, and an outer terminal that is connected to an upper portion of the penetrating electrode. 
     
     
       3. The electronic component according to  claim 2 , wherein the penetrating electrode includes an under bump metal portion and the outer terminal includes a bump. 
     
     
       4. The electronic component according to  claim 1 , wherein the functional unit located on the substrate includes at least one interdigital transducer electrode and is a surface acoustic wave device. 
     
     
       5. The electronic component according to  claim 1 , wherein
 the functional unit is a wafer level chip size packaging surface acoustic wave device. 
 
     
     
       6. The electronic component according to  claim 1 , further comprising additional functional units located on the one main surface of the substrate. 
     
     
       7. The electronic component according to  claim 1 , wherein the frame-shaped supporting body is rectangular or substantially rectangular. 
     
     
       8. The electronic component according to  claim 1 , further comprising pad electrodes located on the one main surface of the substrate and covered by the first and second protrusions. 
     
     
       9. The electronic component according to  claim 3 , wherein the under bump metal portion includes a Ni layer and an Au layer stacked on each other, or a single metal layer. 
     
     
       10. The electronic component according to  claim 6 , wherein the functional units include a plurality of longitudinally coupled resonator type surface acoustic wave filters and a plurality of one-port-type surface acoustic wave resonators. 
     
     
       11. The electronic component according to  claim 1 , wherein one end portion of the second protrusion is spaced in a lateral direction from a position at which an edge of the first protrusion is continuous with the supporting body main body. 
     
     
       12. The electronic component according to  claim 1 , wherein a plurality of the first protrusion is provided inside the supporting body main body at corner portions of the frame-shaped supporting body, and a plurality of the second protrusion is provided. 
     
     
       13. The electronic component according to  claim 12 , wherein the first protrusions and the second protrusions have a rectangular or substantially rectangular shape in plan view. 
     
     
       14. The electronic component according to  claim 1 , wherein the first protrusion extends from one long edge of the supporting body main body so as to reach another long edge on an opposite side in a central region in a length direction of the frame-shaped supporting body. 
     
     
       15. The electronic component according to  claim 1 , wherein the first protrusion is arranged so as to partition a space between two longitudinal edges of the supporting body main body. 
     
     
       16. The electronic component according to  claim 15 , further comprising a transmission filter on a first side of the first protrusion and a reception filter on a second side of the first protrusion. 
     
     
       17. An electronic component manufacturing method for manufacturing the electronic component according to  claim 1 , the method comprising:
 a step of preparing the substrate, on the one main surface on which the functional unit is formed; 
 a step of providing the heat-curable resin on the one main surface of the substrate so as to surround the functional unit on the one main surface of the substrate and so as to contain the frame-shaped supporting body main body, which is separated from the periphery of the substrate on the inner side, and the first and second protrusions; 
 a step of stacking the lid member to form frame-shaped heat-curable resin on the one main surface side of the substrate with the heat-curable resin therebetween; and 
 a step of completing the frame-shaped supporting body, and joining the frame-shaped supporting body, the one main surface of the substrate, and the lid member to one another by curing the heat-curable resin. 
 
     
     
       18. The electronic component manufacturing method according to  claim 17 , further comprising, after the step of completing the frame-shaped supporting body, a step of forming a through hole that penetrates through the first protrusion of the frame-shaped supporting body and the lid member, a step of forming a penetrating electrode in the through hole, and a step of joining an outer terminal to an upper end of the penetrating electrode. 
     
     
       19. The electronic component manufacturing method according to  claim 18 , wherein an under bump metal portion is formed as the penetrating electrode and a bump is formed as the outer terminal. 
     
     
       20. The electronic component manufacturing method according to  claim 17 , wherein a surface acoustic wave substrate is prepared on which a surface acoustic wave element functional unit is formed as the substrate on which the functional unit is formed.